Abstract: The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.

Abstract: The present invention relates to PCGA analytical procedure, in which each PCGA plating/measuring cycle is performed with the stripping and cleaning of test electrode immediately conducted before the equilibrium step, so as to use the metal plate layer formed during a previous plating/measuring cycle as a protective layer for the test electrode. The present invention also relates to PCGA calibration measurement protocol, in which both the calibration measurements and the sample measurement are conducted after a background measurement step.

Abstract: The present invention relates to an electrode assembly that is capable of both solution measurement and in-line self-cleaning. Specifically, such electrode assembly comprises a central electrode and a measurement circuit for solution measurement, and an auxiliary electrode and an auxiliary current sourse for generating gas during intervals between solution measurement cycles, so as to remove any solid or liquid residues that may passivate the central electrode, thereby cleaning and rejuvenating the central electrode and preparing it for the next solution measurement cycle.

Abstract: The present invention relates to an electrode assembly that is capable of both solution measurement and in-line self-cleaning. Specifically, such electrode assembly comprises a central electrode and a measurement circuit for solution measurement, and an auxiliary electrode and an auxiliary current source for generating gas during intervals between solution measurement cycles, so as to remove any solid or liquid residues that may passivate the central electrode, thereby cleaning and rejuvenating the central electrode and preparing it for the next solution measurement cycle.

Abstract: The present invention relates to methods and apparatus for determining concentrations of various inorganic or organic components in solder plating solutions, which include titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis.

Abstract: The present invention relates to PCGA analytical procedure, in which each PCGA plating/measuring cycle is performed with the stripping and cleaning of test electrode immediately conducted before the equilibrium step, so as to use the metal plate layer formed during a previous plating/measuring cycle as a protective layer for the test electrode. The present invention also relates to PCGA calibration measurement protocol, in which both the calibration measurements and the sample measurement are conducted after a background measurement step.

Abstract: The present invention provides for a method of monitoring the concentration of a sulfate salt present in a solution. In accordance with this aspect of the present invention, the concentration of sulfate salt present in the solution is monitored by titrating a known concentration of a barium salt solution with a test sample of the solution containing an unknown amount of sulfate salt under conductivity titration conditions.

Abstract: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, and optionally, the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, provided that the first rotation speed is lower than the second rotation speed, and that the first electroplating duration is shorter than the second electroplating duration.

Abstract: The present invention relates to an electrochemical analytical apparatus for analyzing an electrochemical deposition solution, comprising a testing electrode, and a temperature detector attached thereto for monitoring temperature of said testing electrode. Preferably, such temperature detector is a resistance temperature detector.

Abstract: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, which minimizes the interference between the effects of the brightener and the effects of the leveler, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on either (1) the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, or (2) the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, that the rotation speed of the first set of measurement conditions is lower than the rotation speed of the second set of measurement conditions, and that the electroplating

Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. Plating potentials between the reference and test electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.

Abstract: The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.

Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample.

Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample.

Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample.

Abstract: To detect contamination in used PET returnable bottles, they are fed to a first testing station which takes a gas sample from each bottle. This first testing station tests for the presence of heavy contamination. Heavily contaminated bottles are identified as dirty. The bottles are then fed to a second testing station which takes gas samples from the clean bottles and tests them for contamination with a lower detection threshold. Bottles detected here as contaminated are removed, as are the bottles which fail the first test. The two-stage process allows testing with greater sensitivity while maintaining a high bottle throughput.

Abstract: Inspection of PET bottles for contamination is performed with a mass spectrometer in which the gas sample is ionized by an ionized primary gas. This causes greatly reduced fragmentation, or unambiguous fragmentation, of the gas sample. As a consequence, the spectrum obtained is very meaningful on its own, and can be interpreted very rapidly, which is an essential prerequisite for the use of mass spectrometers in industrial inspection.

Abstract: To detect contamination in used PET returnable bottles, they are fed to a first testing station which takes a gas sample from each bottle. This first testing station tests for the presence of heavy contamination. Heavily contaminated bottles are identified as dirty. The bottles are then fed to a second testing station which takes gas samples from the clean bottles and tests them for contamination with a lower detection threshold. Bottles detected here as contaminated are removed, as are the bottles which fail the first test. The two-stage process allows testing with greater sensitivity while maintaining a high bottle throughput.

Abstract: The sample and the reagent required for titration are fed into a titration vessel (1), the reagent and/or sample being supplied intermittently in the form of pulses of liquid. Toward this end, a controlled valve (9) is provided in the supply line (4) for the reagent. The opening and closing times of this valve (9) and, hence, the frequency and duration of the pulses of liquid, are chosen such that the ratio of the average sample flow to the average reagent flow is sufficient to achieve the ratio of sample to the reagent at the equivalence point. This renders continuous titration possible, for which only one pump (7) is needed, which does not require any complex servo system and, therefore, has a low energy consumption.