Abstract: A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system includes a structural member, including an electrically insulating matrix, an electrically conducting path, a first end surface, a second end surface, and a first component engaging surface. The first component engaging surface includes a first mechanical coupler configured to mechanically couple a first electronic component or a first chassis component to the structural member and a first electrical coupler configured to electrically couple the first electronic component or the first chassis component to a first end of the electrically conducting path.

Abstract: A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system includes a structural member, including an electrically insulating matrix, an electrically conducting path, a first end surface, a second end surface, and a first component engaging surface. The first component engaging surface includes a first mechanical coupler configured to mechanically couple a first electronic component or a first chassis component to the structural member and a first electrical coupler configured to electrically couple the first electronic component or the first chassis component to a first end of the electrically conducting path.

Abstract: A system and method are disclosed for producing nulls in a wideband jamming signal at specific frequency bands. A nulling signal is determined, either as a modification to one or more of the combined signals, or a separately determined nulling signal generated by combine a separate set of signals. The nulling signal is produced via feedback based on the output of the wideband jamming signal. Alternatively, a trained neural network outputs a nulling signal based on the wideband jamming signal and a desired availability band.

Abstract: A vertically integrated circuit assembly may include a substrate including a plurality of electrical traces, and a first circuit assembly layer disposed on the substrate. In embodiments, the first circuit assembly layer includes a first set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the first circuit assembly layer. In embodiments, the vertically integrated circuit assembly further includes a second circuit assembly layer coupled to the top surface of the first circuit assembly layer. The second circuit assembly layer may include a second set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the second circuit assembly layer. In embodiments, an electrical interconnect arrangement on a top surface of the first circuit assembly layer is configured to interface with an electrical interconnect arrangement on the bottom surface of the second circuit assembly layer.

Abstract: An antenna system and method use an electronically-scanned antenna array and a hybrid beam former architecture. The antenna system includes a matrix of antenna elements and a feeder network. The feeder network includes a first layer including phase shifters. Each of the phase shifters is for a respective antenna element of the antenna elements. The feeder network also includes a second layer and a third layer. Each of the first set of the first time delay units in the second layer is for a respective first subarray of the first subarrays of the antenna elements. Each of the second set of the second time delay units in the third layer is for a respective second subarray of the second subarrays of the first subarrays.