Abstract: A pressure collet that operably engages with a die in which the pressure collet is configured to land on predetermined positions of the die without damaging said die, a perform, or a heat spreader during a reflow process. The pressure collet further comprises a plate that has a mounting surface and a plurality of contact pads that operably engages with the mounting surface of the plate. The plurality of contact pads is configured to apply pressure to predetermined positions of a die without the mounting surface of the plate contacting the die during a reflow process. The plate of the pressure collet is also formed of a first material and the plurality of contact pads are formed of a second material different than the first material.

Abstract: A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.

Abstract: A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.