Patents by Inventor Peter M. Winzek

Peter M. Winzek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond assembly jig preparation methods using thermosetting bismaleimide resins
    Patent number: 12521946
    Abstract: A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: January 13, 2026
    Assignee: The Boeing Company
    Inventors: George E. Bible, Peter M. Winzek
  • BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS
    Publication number: 20240190090
    Abstract: A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.
    Type: Application
    Filed: December 6, 2023
    Publication date: June 13, 2024
    Applicant: THE BOEING COMPANY
    Inventors: George E. Bible, Peter M. Winzek