Abstract: A rotatable cover plate assembly (10) has a cavity (13) and a rotatable base plate assembly (12) has a cavity (42) with a semiconductor wafer (14) mounted therein. The cover plate assembly (10) comes down onto the base plate assembly (12) enclosing the semiconductor wafer (14) and a dispenser (28) in a chamber formed by the cavities (13) and (42). The cover and base plates (16) and (40) are rotated as a single assembly, and coating material dispensed by the dispenser (28) onto the semiconductor wafer (14). A flow regulator (25) coupled via an exhaust manifold (20) controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: A rotatable cover plate assembly 10 has a cavity 13 and a rotatable base plate assembly 12 has a cavity 42 with a semiconductor wafer 14 mounted therein. The cover plate assembly 10 comes down onto the base plate assembly 12 enclosing the semiconductor wafer 14 and a dispenser 28 in a chamber formed by the cavities 13 and 42. The cover and base plates 16 and 40 are rotated as a single assembly, and coating material dispensed by the dispenser 28 onto the semiconductor wafer 14. A flow regulator 25 coupled via an exhaust manifold 20 controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: An electroplating chamber that allows substrates such as wafers to be effectively plated with the plating surface facing upwards. A method of reducing non-uniformity in the electroplating process is also disclosed. The chamber includes a bottom and a cover. The bottom contains a sidewall, an opening on top and securing means for securing substrates into the chamber during the plating process. At least one electrode retaining element is provided having at least one first electrode extending therefrom. The electrode retaining element is movable between an operating position and a release position. The cover contains a second electrode held above the substrate by an electrode holder.

Abstract: Disclosed is an apparatus and a method for spin coating chemicals over a surface of a substrate. The apparatus includes a bowl for supporting a substrate, the bowl has a plurality of drain holes defined below the level of the substrate. The apparatus further includes a lid having a flat surface configured to lie a predetermined distance above the substrate and mate with the bowl. Further, a plurality of injection holes defined in the bowl for applying a solvent to an underside of the substrate are included. The plurality of injection holes are defined in along an injection ring that is configured to receive the liquid solvent that is to be applied near an outer radius of the underside of the substrate, and the injection ring is spaced apart from the underside of the substrate.

Abstract: Disclosed is an apparatus and method for spin coating chemicals over a substrate. The apparatus includes a bowl having a raised support for holding the substrate. The bowl includes curved walls that define a cavity capable of holding a fluid near an outer region of the bowl. The apparatus further includes a lid configured to mate with the curved walls. The lid preferably has a substantially flat underside that is positioned in close proximity to a top surface of the substrate. Further, the apparatus includes fluid injector holes defined along an ejection ring that is defined under the substrate. The fluid injector holes are directed at an underside of the substrate that is near the outer diameter of the substrate. The apparatus also includes a plurality of drain holes that are defined on a floor region of the bowl.