Patents by Inventor Peter Maier Brandl

Peter Maier Brandl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices and methods of formation thereof
    Patent number: 10535576
    Abstract: In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of the workpiece. An isolation region is disposed between the first contact pad and the second contact pad. A metal strip is disposed at least partially within the isolation region. The metal strip is not coupled to an external potential node.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: January 14, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Thomas Krotscheck Ostermann, Andrew Christopher Graeme Wood, Peter Maier Brandl
  • Semiconductor Devices and Methods of Formation Thereof
    Publication number: 20180012819
    Abstract: In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of the workpiece. An isolation region is disposed between the first contact pad and the second contact pad. A metal strip is disposed at least partially within the isolation region. The metal strip is not coupled to an external potential node.
    Type: Application
    Filed: September 12, 2017
    Publication date: January 11, 2018
    Inventors: Thomas Krotscheck Ostermann, Andrew Christopher Graeme Wood, Peter Maier Brandl
  • Semiconductor devices and methods of formation thereof
    Patent number: 9799583
    Abstract: In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of the workpiece. An isolation region is disposed between the first contact pad and the second contact pad. A metal strip is disposed at least partially within the isolation region. The metal strip is not coupled to an external potential node.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: October 24, 2017
    Assignee: Infineon Technologies AG
    Inventors: Thomas Krotscheck Ostermann, Andrew Christopher Graeme Wood, Peter Maier Brandl
  • Semiconductor Devices and Methods of Formation Thereof
    Publication number: 20150123131
    Abstract: In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of the workpiece. An isolation region is disposed between the first contact pad and the second contact pad. A metal strip is disposed at least partially within the isolation region. The metal strip is not coupled to an external potential node.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Infineon Technologies AG
    Inventors: Thomas Krotscheck Ostermann, Andrew Christopher Graeme Wood, Peter Maier Brandl