Patents by Inventor Peter Mark DAVULIS

Peter Mark DAVULIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11404388
    Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: August 2, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Yu-Chun Liu, Peter Mark Davulis
  • Patent number: 11202375
    Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: December 14, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Yu-Chun Liu, Peter Mark Davulis
  • Publication number: 20200344894
    Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.
    Type: Application
    Filed: February 19, 2020
    Publication date: October 29, 2020
    Inventors: Yu-Chun LIU, Peter Mark DAVULIS
  • Publication number: 20200343201
    Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted. The first passive component may be an inductor, a capacitor or a resistor. The first passive component is operable as a heat sink, a heat shield, an electromagnetic shield, or as a tuning inductor.
    Type: Application
    Filed: February 19, 2020
    Publication date: October 29, 2020
    Inventors: Yu-Chun LIU, Peter Mark DAVULIS