Abstract: An exercise device includes a resistance unit having a connecting gear. It further includes a cable. It further includes an arm that routes the cable to an actuator. The arm is rotatable relative to the resistance unit about the connecting gear, the arm having a central axis. The arm includes a control that mechanically disengages a locking mechanism from the connecting gear. The control is activated by an activation force substantially directed either toward the central axis of the arm, along a length of the arm, or about the central axis. The activation force is mechanically converted into linear force along the arm that disengages the locking mechanism from the connecting gear.

Abstract: An exercise device includes a resistance unit having a connecting gear. It further includes a cable. It further includes an arm that routes the cable to an actuator. The arm is rotatable relative to the resistance unit about the connecting gear, the arm having a central axis. The arm includes a control that mechanically disengages a locking mechanism from the connecting gear. The control is activated by an activation force substantially directed either toward the central axis of the arm, along a length of the arm, or about the central axis. The activation force is mechanically converted into linear force along the arm that disengages the locking mechanism from the connecting gear.

Abstract: An exercise device includes a resistance unit having a connecting gear. It further includes a cable. It further includes an arm that routes the cable to an actuator. The arm is rotatable relative to the resistance unit about the connecting gear, the arm having a central axis. The arm includes a control that mechanically disengages a locking mechanism from the connecting gear. The control is activated by an activation force substantially directed either toward the central axis of the arm, along a length of the arm, or about the central axis. The activation force is mechanically converted into linear force along the arm that disengages the locking mechanism from the connecting gear.

Abstract: An exercise machine is disclosed. The exercise machine comprises a tension generating device. The exercise machine comprises a translatable arm mount coupled to the tension generating device. The exercise machine comprises an arm coupled to the translatable arm mount. The exercise machine comprises a cable coupled to the tension generating device via the arm.

Abstract: An exercise machine is disclosed. The exercise machine comprises a tension generating device. The exercise machine comprises a translatable arm mount coupled to the tension generating device. The exercise machine comprises an arm coupled to the translatable arm mount. The exercise machine comprises a cable coupled to the tension generating device via the arm.

Abstract: An exercise device includes a resistance unit having a connecting gear. It further includes a cable. It further includes an arm that routes the cable to an actuator. The arm is rotatable relative to the resistance unit about the connecting gear, the arm having a central axis. The arm includes a control that mechanically disengages a locking mechanism from the connecting gear. The control is activated by an activation force substantially directed either toward the central axis of the arm, along a length of the arm, or about the central axis. The activation force is mechanically converted into linear force along the arm that disengages the locking mechanism from the connecting gear.

Abstract: An exercise machine is disclosed. The exercise machine comprises a tension generating device. The exercise machine comprises a translatable arm mount coupled to the tension generating device. The exercise machine comprises an arm coupled to the translatable arm mount. The exercise machine comprises a cable coupled to the tension generating device via the arm.

Abstract: Semiconductor devices are described that have a through-substrate via formed therein. In one or more implementations, the semiconductor devices include a semiconductor wafer and an integrated circuit die bonded together with an adhesive material. The semiconductor wafer and the integrated circuit die include one or more integrated circuits formed therein. The integrated circuits are connected to one or more conductive layers deployed over the surfaces of the semiconductor wafer and an integrated circuit die. A via is formed through the semiconductor wafer and the patterned adhesive material so that an electrical interconnection can be formed between the integrated circuits formed in the semiconductor wafer and the integrated circuits formed in the integrated circuit die. The via includes a conductive material that furnishes the electrical interconnection between the semiconductor wafer and the integrated circuit die.

Abstract: Semiconductor devices are described that have a through-substrate via formed therein. In one or more implementations, the semiconductor devices include a semiconductor wafer and an integrated circuit die bonded together with an adhesive material. The semiconductor wafer and the integrated circuit die include one or more integrated circuits formed therein. The integrated circuits are connected to one or more conductive layers deployed over the surfaces of the semiconductor wafer and an integrated circuit die. A via is formed through the semiconductor wafer and the patterned adhesive material so that an electrical interconnection can be formed between the integrated circuits formed in the semiconductor wafer and the integrated circuits formed in the integrated circuit die. The via includes a conductive material that furnishes the electrical interconnection between the semiconductor wafer and the integrated circuit die.

Abstract: Semiconductor devices are described that have a through-substrate via formed therein. In one or more implementations, the semiconductor devices include a semiconductor wafer and an integrated circuit die bonded together with an adhesive material. The semiconductor wafer and the integrated circuit die include one or more integrated circuits formed therein. The integrated circuits are connected to one or more conductive layers deployed over the surfaces of the semiconductor wafer and an integrated circuit die. A via is formed through the semiconductor wafer and the patterned adhesive material so that an electrical interconnection can be formed between the integrated circuits formed in the semiconductor wafer and the integrated circuits formed in the integrated circuit die. The via includes a conductive material that furnishes the electrical interconnection between the semiconductor wafer and the integrated circuit die.

Abstract: Semiconductor devices are described that have a through-substrate via formed therein. In one or more implementations, the semiconductor devices include a semiconductor wafer and an integrated circuit die bonded together with an adhesive material. The semiconductor wafer and the integrated circuit die include one or more integrated circuits formed therein. The integrated circuits are connected to one or more conductive layers deployed over the surfaces of the semiconductor wafer and an integrated circuit die. A via is formed through the semiconductor wafer and the patterned adhesive material so that an electrical interconnection can be formed between the integrated circuits formed in the semiconductor wafer and the integrated circuits formed in the integrated circuit die. The via includes a conductive material that furnishes the electrical interconnection between the semiconductor wafer and the integrated circuit die.