Patents by Inventor Peter Mederer

Peter Mederer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for producing the same
    Patent number: 7781897
    Abstract: A semiconductor device has a circuit carrier with a number of internal contact areas is disclosed, which includes a first material with a first electrochemical potential, and a semiconductor chip with an active surface and a number of chip contact areas, which include a second material with a second electrochemical potential. Bonding wire connections are arranged between the chip contact areas and the internal contact areas of the leadframe and comprise a third material with a third electrochemical potential. The connecting points between the chip contact areas and the bonding wires and/or the connecting points between the internal contact areas and the bonding wires are coated with an anticorrosive layer.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: August 24, 2010
    Assignee: Infineon Technologies AG
    Inventors: Khalil Hosseini, Eduard Knauer, Joachim Mahler, Peter Mederer, Konrad Roesl
  • Semiconductor device and method for producing the same
    Publication number: 20070090539
    Abstract: A semiconductor device has a circuit carrier with a number of internal contact areas is disclosed, which includes a first material with a first electrochemical potential, and a semiconductor chip with an active surface and a number of chip contact areas, which include a second material with a second electrochemical potential. Bonding wire connections are arranged between the chip contact areas and the internal contact areas of the leadframe and comprise a third material with a third electrochemical potential. The connecting points between the chip contact areas and the bonding wires and/or the connecting points between the internal contact areas and the bonding wires are coated with an anticorrosive layer.
    Type: Application
    Filed: May 31, 2006
    Publication date: April 26, 2007
    Inventors: Khalil Hosseini, Eduard Knauer, Joachim Mahler, Peter Mederer, Konrad Roesl