Abstract: The present invention relates to a carrier substrate comprising thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the carrier substrate further comprises a first substrate with thermal vias configured to be connected to a first component; a second substrate comprising a groove with a heat pipe; and wherein the first substrate is adhered to the second substrate by an adhesive, such that the heat pipe is embedded in said groove between the first substrate and the second substrate. The present invention also relates to an electronic assembly comprising such a carrier substrate.

Abstract: A heat spreader for heat transfer from a heat generating electronic component having a coefficient of thermal expansion, CTEX. The heat spreader includes a plate of a first thermally conductive material with a first side configured to be in thermal contact with the heat generating electronic component, and an opposing second side. The first thermally conductive material has a first CTE, CTE1; a plurality of holes extending in a direction between the first side and the second side; a second thermally conductive material with a second CTE, CTE2, disposed in said holes; wherein the heat spreader has a CTEC based on the volume, V1, of the first thermally conductive material and the CTE1, and the volume, V2, of the second thermally conducting material and the CTE2 such that 0.5<CTEX/CTEC<1.5.

Abstract: The present invention relates to a carrier substrate comprising thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the carrier substrate further comprises a first substrate with thermal vias configured to be connected to a first component; a second substrate comprising a groove with a heat pipe; and wherein the first substrate is adhered to the second substrate by an adhesive, such that the heat pipe is embedded in said groove between the first substrate and the second substrate. The present invention also relates to an electronic assembly comprising such a carrier substrate.

Abstract: The present invention relates to a method (100) of producing a printed circuit board (300), wherein the printed circuit board (300) comprises a first substrate (301), a second substrate (302), and a heat pipe tube (303) with an open end (304). The method comprises the step of forming (S100) a recess (305) in the first substrate (301), placing (S120) the heat pipe tube (303) in the recess (305) of the first substrate (301) such that the open end (304) is exposed, and laminating (S130) the first substrate (301) and the second substrate (302) with the heat pipe tube (304) embedded in the recess (305) between the first substrate (301) and the second substrate (302). The present invention also relates to a printed circuit board, a circuit board as well as a method for producing a circuit board.

Abstract: The present disclosure relates to waveguide band-stop filter arrangement adapted to be connected to a waveguide transmission line at a filter interface, where the waveguide transmission line is adapted for a main propagation extension. The band-stop filter arrangement comprises a first pair of cavities, where each cavity in the first pair, each first pair cavity, comprises a corresponding inductive first pair aperture arrangement that is adapted to connect the corresponding first pair cavity to the waveguide transmission line. The first pair cavities are positioned adjacent each other along a stacking extension perpendicular to the main propagation extension such that they share a first common wall and are adapted to be positioned adjacent the waveguide transmission line. The first pair of cavities comprises a first capacitive aperture arrangement in the first common wall, mutually connecting the first pair cavities.

Abstract: The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.

Abstract: The present disclosure relates to waveguide band-stop filter arrangement adapted to be connected to a waveguide transmission line at a filter interface, where the waveguide transmission line is adapted for a main propagation extension. The band-stop filter arrangement comprises a first pair of cavities, where each cavity in the first pair, each first pair cavity, comprises a corresponding inductive first pair aperture arrangement that is adapted to connect the corresponding first pair cavity to the waveguide transmission line. The first pair cavities are positioned adjacent each other along a stacking extension perpendicular to the main propagation extension such that they share a first common wall and are adapted to be positioned adjacent the waveguide transmission line. The first pair of cavities comprises a first capacitive aperture arrangement in the first common wall, mutually connecting the first pair cavities.

Abstract: The present invention relates to a carrier substrate (30) comprising signal vias (41) for electrically interconnecting components (10, 31) arranged on opposing sides of the carrier substrate (30). The carrier substrate (30) further comprises: at least one cavity (20) embedded in the carrier substrate (30) having at least one chamber wick part (24) and a working fluid, and wherein the at least one cavity (20) at least partially encompass the signal vias (41). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate (30).

Abstract: The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.

Abstract: The present invention relates to a carrier substrate (30) comprising signal vias (41) for electrically interconnecting components (10, 31) arranged on opposing sides of the carrier substrate (30). The carrier substrate (30) further comprises: at least one cavity (20) embedded in the carrier substrate (30) having at least one chamber wick part (24) and a working fluid, and wherein the at least one cavity (20) at least partially encompass the signal vias (41). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate (30).