Abstract: A liquid dispense system for dispensing a 2-part epoxy resin compound to form bond beads having weights on the order of 1-20 mg. The dispensing system includes an epoxy resin compound pre-mixing and loading station, an epoxy dispense time and dispense force calibration station, and a plurality of epoxy dispensing third stations. Throughout the process, critical dispense related data is recorded on, and retrieved from, an on-board semiconductor memory device mounted on, and maintained with, the portable dispense syringe structure. Since the viscosity of the mixed epoxy compound is changing over time, any dispensing of constant amounts of the epoxy compound requires adjustments to dispense time and dispense force. These adjustments are made at a dispense station and are based on a calibration sample taken at the calibration station.