Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

Abstract: A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.

Abstract: A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.