Abstract: A multi-purpose electronic device holder used for selfie and in a car comprises a gripping unit clamped elastically on a flange at a periphery of dashboard in front of a driver's seat. The gripping unit includes a first coupling rod slidably provided with a screwing element. The screwing element is optionally screwed to a second coupling rod having an electronic device fixing mount or to a selfie stick. When an electronic device is limited and fixed by the electronic device fixing mount clamped on the flange at the periphery of dashboard, the electronic device is fixed in front of the driver who will not need to lean forward deliberately to operate the electronic device. Moreover, when getting off the car, the driver can easily remove the second coupling rod from the first coupling rod to carry or adapt the second coupling rod onto the selfie stick for selfie.

Abstract: A system and a method for moving a wafer during scanning the wafer by an ion beam. The proposed system includes an extendable/retractable arm, a holding apparatus and a driving apparatus. At least a length of the extendable/retractable arm is adjustable. The holding apparatus is capable of holding a wafer and is fixed on a specific portion of the extendable/retractable arm. Furthermore, the driving apparatus is capable of extending and/or retracting the extendable/retractable arm, such that the holding apparatus is moved together with the specific portion. In addition, the proposed method includes the following steps. First, hold the wafer by a holding apparatus fixed on a specific portion of an extendable/retractable arm. After that, adjust a length of the extendable/retractable. Therefore, the holding apparatus, i.e. the wafer, can be moved by the extension/retraction of the extendable/retractable arm.

Abstract: A wind turbine includes two sets of blades. A first set of blades is placed at a front location of the wind turbine. A second set of blades is placed behind the first set of blades. The first set of blades turns in an area within a first circumference. The second set of blades are mounted at a location sufficiently away from an axis of rotation of the wind turbine so that the second set of blades turns within an area that is within a second circumference and that is substantially outside the first circumference.

Abstract: A wind turbine includes two sets of blades. A first set of blades is placed at a front location of the wind turbine. A second set of blades is placed behind the first set of blades. The first set of blades turns in an area within a first circumference. The second set of blades are mounted at a location sufficiently away from an axis of rotation of the wind turbine so that the second set of blades turns within an area that is within a second circumference and that is substantially outside the first circumference.

Abstract: A method and an apparatus for dechucking an electrostatic chuck are disclosed. The gas escapes through an opening between a wafer and a chuck in each stage of a multi-stages process. In each stage, during at least a portion of the stage, the chucking voltage is reduced to a value less than the least threshold voltage needed for holding the wafer, so that the wafer is pushed away from the chuck by the gas. Hence, the gas can escape from an opening between the wafer and the chuck, thereby increasing the dechucking rate. By controlling the decrement and/or the duration of the reduced voltage, any potential damages due to the pushed-away wafer can be minimized.

Abstract: A system and a method for moving a wafer during scanning the wafer by an ion beam. The proposed system includes an extendable/retractable arm, a holding apparatus and a driving apparatus. At least a length of the extendable/retractable arm is adjustable. The holding apparatus is capable of holding a wafer and is fixed on a specific portion of the extendable/retractable arm. Furthermore, the driving apparatus is capable of extending and/or retracting the extendable/retractable arm, such that the holding apparatus is moved together with the specific portion. In addition, the proposed method includes the following steps. First, hold the wafer by a holding apparatus fixed on a specific portion of an extendable/retractable arm. After that, adjust a length of the extendable/retractable. Therefore, the holding apparatus, i.e. the wafer, can be moved by the extension/retraction of the extendable/retractable arm.

Abstract: A method and an apparatus for dechucking an electrostatic chuck are disclosed. The gas escapes through an opening between a wafer and a chuck in each stage of a multi-stages process. In each stage, during at least a portion of the stage, the chucking voltage is reduced to a value less than the least threshold voltage needed for holding the wafer, so that the wafer is pushed away from the chuck by the gas. Hence, the gas can escape from an opening between the wafer and the chuck, thereby increasing the dechucking rate. By controlling the decrement and/or the duration of the reduced voltage, any potential damages due to the pushed-away wafer can be minimized.

Abstract: This invention pertains to a suspender set intended to be worn with a belt and worn under a person's shirt where it can not be seen that the person is wearing suspenders. The suspender set is particularly useful for a uniformed officer who carries heavy equipment on a belt, but can not wear suspenders because of uniform requirements. The invention is also useful for people who would like to wear shirt and suspenders without the societal stigma associated with wearing both belt and suspenders.

Abstract: A method and apparatus provide polishing of a semiconductor wafer or other substrate. The apparatus includes multiple wafer carriers provided on the top surface of a table. A semiconductor wafer is seated face-up in the wafer carrier. Each wafer carrier is driven by an electric motor to rotate at a low speed. During operation, each wafer carrier is positioned at a work station where a specified task is performed. The table rotates when the task at each station is completed to move the wafers from station to station. Thus multiple tasks relating to polishing (e.g., buffing and drying) can be carried out in parallel. At one station, a polishing pad is positioned by a polishing pad carrier face-down to polish the surface of the semiconductor wafer. A motor drives the polishing pad to move in a high-speed circular motion.

Abstract: A slurry dispenser dispensing slurry by a pair of counter-rotating wheels is provided in a chemical mechanical polishing process used in manufacturing integrated circuits. The slurry dispenser is driven by variable speed motors at a predetermined speed empirically determined to dispense a desired amount of slurry. The shape of the rotating wheels controls the vertical distribution of the spray. Openings in the housing of the slurry dispenser and the speed of rotation of the wheels controls the horizontal distribution of the spray. The slurry dispenser can be constructed out of materials chemically inert with respect to the slurry.

Abstract: Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.

Abstract: A slurry dispenser dispensing slurry by a rotating wheel is provided in a chemical-mechanical polishing process used in manufacturing integrated circuits. The slurry dispenser is driven by a variable speed motor at a predetermined speed empirically determined to dispense a desired amount of slurry. A groove is provided along the circumfrence of the rotating wheel to control the width of the spray. At the same time, walls in the housing of the slurry dispenser restrict the angle of the spray. The slurry dispenser can be constructed out of material chemically inert with respect to the slurry.

Abstract: A beverage carrier apparatus that can be securely fastened to a structure such as a ventilation fixture of a vehicle is disclosed, the carrier apparatus laterally receiving a container of the beverage. The apparatus includes a housing having a supporting surface for the container, a hook member and associated clamp screw for clamping the housing to the fixture, by engaging a louver of the fixture, and a plurality of finger members for releasably holding the container on the supporting surface. The housing forms a duct for transmitting ventilating or cooling air from the fixture, the air passing in communication with the container for cooling the beverage, and then to the interior of the vehicle.