Abstract: Peroxyformic acid compositions for removal of biofilm growth and other contaminants and impurities from industrial processing hard surfaces are disclosed. In particular, peroxyformic acid compositions may be dosed on site and/or generated in situ for the reduction and prevention of biofilms on the hard surfaces. Methods of employing the peroxyformic acid compositions for removal of biofilm growth and other impurities such as aldehydes and alcohols from industrial CO2 effluent are also disclosed which beneficially provide ambient biofilm control and break down more rapidly than other peracids, allowing for extended runs between CIP cleaning, including a reduction and/or elimination of cleaning of the scrubbers and other industrial surfaces.

Abstract: An apparatus for generating a data stream according to an embodiment is provided. The apparatus is configured to generate the data stream, such that the data stream has header data and payload data. The apparatus is configured to generate the header data such that the header data comprises a synchronization header. Moreover, the apparatus is configured to generate the synchronization header using binary coding. Furthermore, the apparatus is configured to generate the synchronization header such that the synchronization header comprises a synchronization sequence being a predefined bit sequence having a plurality of bits.

Abstract: A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

Abstract: In an embodiment a component includes a common carrier, a plurality of component parts, converter layers and internal scattering regions, wherein the component parts are arranged side by side in a lateral direction and vertically between the common carrier and the converter layers, wherein the component has a pass-through region and a radiation exit surface which, in a vertical direction, is spaced apart from the converter layers by the pass-through region, wherein adjacent converter layers are laterally spaced from each other by an intermediate region which, in top view of the carrier, is completely covered by the pass-through region, and wherein the inner scattering regions adjoin the pass-through region and the converter layers and are arranged at least partially in the intermediate region or directly adjoin the intermediate region.

Abstract: An apparatus for transmitting a plurality of data streams is provided, having a scheduling unit for selecting a data stream as a selected data stream and a transmission unit for transmitting the selected data stream. The scheduling unit is configured to select the selected data stream depending on scheduling information and a counter value, the scheduling information having a plurality of scheduling elements. A data stream is assigned to each scheduling element, wherein the data stream information of the scheduling element is data stream information for the data stream assigned to the scheduling element. A selection criterion is fulfilled or not fulfilled depending on the selection information of each scheduling element and the counter value. Depending on an order of the plurality of scheduling elements, the scheduling unit is configured to select, as the selected data stream, a data stream, which is assigned to a selection element, for which the selection criterion is fulfilled.

Abstract: In an embodiment an optoelectronic semiconductor component includes a semiconductor body having an active region configured to generate first electromagnetic radiation, a wavelength conversion element having a conversion region and a sacrificial region, the conversion region configured to convert at least a portion of the first electromagnetic radiation to second electromagnetic radiation and a shaped body in which the semiconductor body and the wavelength conversion element are at least partially embedded and which is at least in places directly adjacent to the semiconductor body and the wavelength conversion element, wherein the conversion region is arranged between the sacrificial region and the semiconductor body, wherein the sacrificial region is transmissive to the first and second electromagnetic radiations, and wherein the shaped body is a reflector for the first and second electromagnetic radiations.

Abstract: An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.

Abstract: An optoelectronic component includes a carrier including a mounting face, wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face, a molding material is arranged above the mounting face, the optoelectronic semiconductor chips are embedded into the molding material, a cavity is formed in the molding material, the cavity is empty, radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material, the cavity is accessible through an opening in the molding material, and an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.

Abstract: A method of producing a lighting device includes a radiation-emitting optoelectronic component, including: arranging the component on a carrier, applying a first layer on the carrier, wherein the first layer surrounds the component at least laterally in the form of a circumferential frame, and subsequently applying a second layer on the first layer laterally next to the frame, wherein the second layer includes a greater hardness than the first layer.

Abstract: A process of forming an ethynylation catalyst includes providing a slurry including water, a copper-containing material, a bismuth-containing material, a structural material, and a binder; spray-drying the slurry to form particles; and calcining the particles to form the ethynylation catalyst.

Abstract: A method for liquid-jet cutting, including a compressor unit (3), which compresses a liquid for producing a liquid jet, and a nozzle (10), which is connected to the compressor unit (3) and which has an outlet opening (11), through which the compressed liquid exits in the form of a liquid jet (14). The one flow of the compressed liquid to the outlet opening (11) is interrupted or enabled by an interrupting unit (8). The following steps are performed: compressing the liquid by the compressor unit (3), moving the outlet opening (11) toward a workpiece (15) to be processed until a processing distance (d) is reached, alternately enabling and interrupting the liquid jet (14) by the interrupting unit (8), wherein simultaneously the nozzle is moved in relation to the workpiece in a processing direction (22) and the pulse duration (tp; tp1; tp2) of the liquid jet is less than 1000 ?s.

Abstract: An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and a second carrier, wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, and an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.

Abstract: An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.

Abstract: A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

Abstract: A method of producing a lighting device includes a radiation-emitting optoelectronic component, including: arranging the component on a carrier, applying a first layer on the carrier, wherein the first layer surrounds the component at least laterally in the form of a circumferential frame, and subsequently applying a second layer on the first layer laterally next to the frame, wherein the second layer includes a greater hardness than the first layer.

Abstract: An optoelectronic component includes a carrier including a mounting face, wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face, a molding material is arranged above the mounting face, the optoelectronic semiconductor chips are embedded into the molding material, a cavity is formed in the molding material, the cavity is empty, radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material, the cavity is accessible through an opening in the molding material, and an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.

Abstract: A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).

Abstract: A process of forming an ethynylation catalyst includes providing a slurry including water, a copper-containing material, a bismuth-containing material, a structural material, and a binder; spray-drying the slurry to form particles; and calcining the particles to form the ethynylation catalyst.

Abstract: The invention relates to a method for liquid-jet cutting, comprising a compressor unit (3), which compresses a liquid for producing a liquid jet, and a nozzle (10), which is connected to the compressor unit (3) and which has an outlet opening (11), through which the compressed liquid exits in the form of a liquid jet (14). The one flow of the compressed liquid to the outlet opening (11) can be interrupted or enabled by means of an interrupting unit (8). The following steps are performed: compressing the liquid by means of the compressor unit (3), moving the outlet opening (11) toward a workpiece (15) to be processed until a processing distance (d) is reached, alternately enabling and interrupting the liquid jet (14) by means of the interrupting unit (8), wherein at the same time the nozzle is moved in relation to the workpiece in a processing direction (22) and the pulse duration (tp; tp1; tp2) of the liquid jet is less than 1000 ?s.

Abstract: Catalysts and methods for their manufacture and use for the dehydrogenation of alcohols are disclosed. The catalysts and methods utilize a highly dispersible alumina, for example, boehmite or pseudoboehmite, to form catalysts that exhibit high dehydrogenation activities. Specifically, the catalysts include Cu that is highly dispersed by reaction of an alumina formed by peptizing of boehmite or pseudoboehmite and precursors of ZrO2, ZnO and CuO.