Abstract: The present invention relates to a method for stabilising the operation of a voltage controlled oscillator driven by a phase locked loop, the voltage controlled oscillator delivering an RF signal and receiving through at least one spurious path a harmonic component of a frequency equal or proximate to that of the RF signal, capable of disturbing its operation by injection pulling. According to the present invention, the method comprises a step of injecting into the voltage controlled oscillator an injection pulling compensation signal, the phase and the amplitude of which are adjusted so as to neutralise the effects of the spurious harmonic component. Application particularly to phase modulation IQ circuits in radiotelephony.

Abstract: The present invention relates to a method for stabilising the operation of a voltage controlled oscillator (VCO) driven by a phase locked loop (PLL), the voltage controlled oscillator delivering an RF signal and receiving through at least one spurious path a harmonic component of a frequency equal or proximate to that of the RF signal, capable of disturbing its operation by injection pulling. According to the present invention, the method comprises a step of injecting into the voltage controlled oscillator an injection pulling compensation signal, the phase and the amplitude of which are adjusted so as to neutralise the effects of the spurious harmonic component. Application particularly to phase modulation IQ circuits in radiotelephony.

Abstract: A method for the calibration of an RF integrated circuit probe comprising a step to determine the characteristics of the RF transmission lines of the probe by means of a vector network analyzer and standard circuits on silicon substrate. The standard circuits comprise contact pads corresponding by their layout to RF connection pads of the integrated circuits to be tested.

Abstract: The invention relates to an elementary standard structure for the determining of the RF characteristics of an RF integrated circuit probe, comprising at least two contact pads deposited on a silicon substrate by means of an electrically insulating layer, at least one standard load that is measurable from the contact pads and a conductive screen buried beneath the insulating layer. The invention relates also to a standard circuit comprising a plurality of elementary standard structures arranged so as to present contact pads corresponding by their location to RF connection pads of the integrated circuit to be tested.