Patents by Inventor Peter Ngo

Peter Ngo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Waveguide and semiconductor packaging
    Patent number: 9960204
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: May 1, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
  • WAVEGUIDE AND SEMICONDUCTOR PACKAGING
    Publication number: 20170018597
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 19, 2017
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
  • Waveguide and semiconductor packaging
    Patent number: 9478458
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: October 25, 2016
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
  • WAVEGUIDE AND SEMICONDUCTOR PACKAGING
    Publication number: 20140254979
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Application
    Filed: January 8, 2014
    Publication date: September 11, 2014
    Applicant: Northrop Grumman Systems Corporation
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal