Patents by Inventor Peter Ngo

Peter Ngo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250325419
    Abstract: Disclosed is a pediatric emergency kit for esophageal tamponade procedures in pediatric patients and methods of use thereof. The pediatric emergency kit includes at least one esophageal balloon catheter for the tamponade of blood flow, and an inflation hand pump equipped with a pressure gauge for inflating a balloon on the balloon catheter. The pediatric emergency kit can be configured to include multiple compartments, optionally, with a first container/compartment containing at least the esophageal balloon catheter and a second container/compartment containing at least the inflation handpump, and optionally a second esophageal balloon catheter. Optionally, both the first and second containers/compartments contain a syringe, a 3-way luer lock stopcock, and/or a guidewire. Also provided are instructions and/or methods of using the kit for correct placement and inflation of the esophageal balloon to effectively manage arterio-esophageal fistulas.
    Type: Application
    Filed: January 27, 2025
    Publication date: October 23, 2025
    Inventor: Peter Ngo
  • Patent number: 9960204
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: May 1, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
  • Publication number: 20170018597
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 19, 2017
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
  • Patent number: 9478458
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: October 25, 2016
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal
  • Publication number: 20140254979
    Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
    Type: Application
    Filed: January 8, 2014
    Publication date: September 11, 2014
    Applicant: Northrop Grumman Systems Corporation
    Inventors: Chunbo Zhang, Peter Ngo, Gershon Akerling, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig, William R. Deal