Patents by Inventor Peter Nikolaus Oberhumer

Peter Nikolaus Oberhumer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for bonding substrates
    Patent number: 11862466
    Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: January 2, 2024
    Assignee: EV Group E. Thallner GmbH
    Inventors: Kurt Hingerl, Peter Nikolaus Oberhumer, Gunther Hesser
  • METHOD AND DEVICE FOR BONDING SUBSTRATES
    Publication number: 20210202251
    Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
    Type: Application
    Filed: February 12, 2021
    Publication date: July 1, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Kurt Hingerl, Peter Nikolaus Oberhumer, Gunther Hesser
  • Method and device for bonding substrates
    Patent number: 10971365
    Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 6, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Kurt Hingerl, Peter Nikolaus Oberhumer, Gunther Hesser
  • METHOD AND DEVICE FOR BONDING SUBSTRATES
    Publication number: 20190393037
    Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
    Type: Application
    Filed: February 21, 2017
    Publication date: December 26, 2019
    Applicant: EV Group E. Thallner GmbH
    Inventors: Kurt Hingerl, Peter Nikolaus Oberhumer, Gunther Hesser