Abstract: The present invention provides an organic chip carrier particularly useful with flip chips. The chip carrier comprises an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry. The fine line circuitry has a line width of about 2.0 mil or less, preferably about 1.0 mil or less, and more preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.

Abstract: The use of water-dispersible polyisocyanates with anionic and/or potentially anionic groups and cationic and/or potentially cationic compounds in paper finishing leads not only to higher retention but also to improved dry and wet strength and sizing.

Abstract: The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.

Abstract: The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 3.5% The invention also relates to methods of making the dielectric coated chip carrier.

Abstract: Process for the production of optionally wood-containing cellulose-containing sheet-like structures, such as paper, pasteboard and card, which have been given a dry strength and/or wet strength treatment and have improved whiteness, using water-dispersible isocyanates, wherein the water-dispersible isocyanates:a) are aliphatic, cycloaliphatic, araliphatic or aromatic isocyanates having an NCO functionality of 1.8 to 4.2, mixed with polyether-modified aliphatic, cycloaliphatic, araliphatic or aromatic isocyanates having an average NCO functionality of 0.8 to 3.2,b) the isocyanate mixtures a) contain 1 to 25% by weight of isocyanate groups,c) have a content of ethylene oxide units, arranged in the form of polyether chains of average molecular weight 10 to 3500 (number-average), of 20 to 60% by weight, based on the isocyanate mixture, and if appropriated) have a content of tertiary amino groups and/or ammonium groups of 1 to 500 milliequivalents per 100 g of isocyanate mixture a).

Abstract: Process for fixing anionic interfering substances in papermaking process by the addition of cationic polycondensation products obtained by reactinga) a monofunctional or polyfunctional amine having one or more primary and/or secondary and/or tertiary amino groups withb) cyanamide, dicyandiamide, guanidine or biguanidine, wherein up to 50 mol. % of cyanamide, dicyandiamide or biguanidine may be replaced with a dicarboxylic acid or a mono- or diester thereof, with elimination of ammonia, optionally in the presence of a catalyst,optionally together with other auxiliaries.

Abstract: A support structure is attached to the front or back side of a flexible circuit by direct mounting to the flexible circuit flat ribbon cable, thereby providing a stress-free region of the cable in which the flexible circuit electrical components can be mounted. The support structure comprises a flat ring that is attached to the cable by adhesive, soldering, or mechanical fastening. The flat ring mounts on one side of the flat ribbon cable and encloses an area of the cable that is sufficiently large for the mounting of the flexible circuit electrical components. The flat ribbon cable within the enclosed area is held flat and free from stress, even as the cable is handled. Thus, any components mounted within the enclosed area are not subjected to bending moments. The invention also can be incorporated into cable connectors, such as multi-pin connectors at the ends of cables, and can include support hooks and air cooling baffles.

Abstract: Surface-distributed hydrocarbons, in particular mineral oil and mineral oil processing products, are removed by allowing water and a polyether containing isocyanate end groups to act on the hydrocarbons and by mechanically removing the gel containing hydrocarbons which is formed.

Abstract: An assembly comprising a drive motor connected to a member to be rotated by a transmission means which is liable to slip when the rotating member is subjected to a loading thereon, includes a compensation circuit connected to the motor control circuit and operable to apply to the latter a compensation signal proportional to the change in a parameter directly related to the motor torque, thereby to compensate for slipping of the transmission means.