Patents by Inventor Peter Nyholm

Peter Nyholm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser delamination of thin metal film using sacrificial polymer layer
    Publication number: 20070210420
    Abstract: A plastic substrate is provided, on which is disposed a sacrificial polymer layer and a thin metal film over the sacrificial polymer layer. The thin metal film is laser-delamination patterned. The sacrificial polymer layer is at least partially removed via laser delamination where the thin metal film has been removed via laser delamination.
    Type: Application
    Filed: March 11, 2006
    Publication date: September 13, 2007
    Inventors: Curt Nelson, Ronald Hellekson, Peter Nyholm, Michael French
  • Method and/or system for forming a thin film
    Publication number: 20070173051
    Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming a thin film are described.
    Type: Application
    Filed: March 25, 2007
    Publication date: July 26, 2007
    Inventors: Curt Nelson, David Punsalan, Peter Nyholm
  • Method to form an interconnect
    Publication number: 20070037387
    Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described.
    Type: Application
    Filed: October 12, 2006
    Publication date: February 15, 2007
    Inventors: Jian-Gang Weng, Ravi Prasad, Cary Addington, Peter Nyholm
  • Method to form an interconnect
    Publication number: 20060030141
    Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described.
    Type: Application
    Filed: August 4, 2004
    Publication date: February 9, 2006
    Inventors: Jian-Gang Weng, Ravi Prasad, Cary Addington, Peter Nyholm
  • Laser enhanced plating
    Publication number: 20060008627
    Abstract: A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.
    Type: Application
    Filed: July 9, 2004
    Publication date: January 12, 2006
    Inventors: Peter Nyholm, Curt Nelson, Niranjan Thirukkovalur, Paul McClelland
  • Method and/or system for forming a thin film
    Publication number: 20050202681
    Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming a thin film are described.
    Type: Application
    Filed: March 12, 2004
    Publication date: September 15, 2005
    Inventors: Curt Nelson, David Punsalan, Peter Nyholm
  • Uses of uniaxially electrically conductive articles
    Patent number: 5678287
    Abstract: Polymer (preferably polyimide) sheets with laser ablated through-holes plated with metal are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4-4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: October 21, 1997
    Assignee: Raychem Limited
    Inventors: Nicholas J. G. Smith, Michael Joseph Ludden, Peter Nyholm, Paul James Gibney
  • Uses of uniaxially electrically conductive articles
    Patent number: 5637925
    Abstract: The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: June 10, 1997
    Inventors: Michael J. Ludden, Nicholas J. G. Smith, Paul J. Gibney, Peter Nyholm
  • Uses of uniaxially electrically conductive articles
    Patent number: 5631447
    Abstract: Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical conections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phylenediamine, preferably p-phenylenediamine).
    Type: Grant
    Filed: January 3, 1995
    Date of Patent: May 20, 1997
    Assignee: Raychem Limited
    Inventors: Nicholas J. G. Smith, Michael J. Ludden, Peter Nyholm, Paul J. Gibney
  • Hybrid microchip bonding article
    Patent number: 5254811
    Abstract: An article for tape-automated bonding of integrated circuit microchips comprises a carrier sheet (22) carrying conductive tracks (23) with a tubular metal formation (21) passing through the sheet at the end of each track for connection to a microchip (24). The tubular formations tend to accommodate irregularities in the chip and may contain solder or other metal having a lower melting point than the tubular formation to effect bonding.
    Type: Grant
    Filed: May 16, 1991
    Date of Patent: October 19, 1993
    Assignee: Raychem Limited
    Inventors: Michael J. Ludden, Peter Nyholm
  • Laminar polymeric sheet
    Patent number: 5194316
    Abstract: A sheet laminate of polyimide and amorphous polyamide especially suitable for making anisotropically electrically conductive articles by laser abiation drilling followed by metal plating. Preferred polyimides include those derived from polymerization of 4,4'biphenyldianhydride and 4,4'-diaminobiphenylether or p-phenylenediamine. Preferred amorphous polyamides include those derived from condensation of terephthalic acid with isomers of trimethylhexamethylenediamine.
    Type: Grant
    Filed: February 26, 1991
    Date of Patent: March 16, 1993
    Assignee: Raychem Limited
    Inventors: Patrick J. Horner, Michael J. Ludden, Peter Nyholm, Nicholas J. G. Smith, Richard J. Penneck