Abstract: Systems and methods for virtual agronomic sensing are provided. In embodiments methods comprise receiving first agronomic data for a first geographic location comprising sensor data from agronomic sensors at the first geographic location; receiving first agronomic information for the first geographic location; and generating first predictive agronomic data for the first geographic location using the first agronomic data for the first geographic location and the first agronomic information for the first geographic location.

Abstract: Systems and methods for virtual agronomic sensing are provided. In embodiments methods comprise receiving first agronomic data for a first geographic location comprising sensor data from agronomic sensors at the first geographic location; receiving first agronomic information for the first geographic location; and generating first predictive agronomic data for the first geographic location using the first agronomic data for the first geographic location and the first agronomic information for the first geographic location.

Abstract: Systems and methods for virtual agronomic sensing are provided. In embodiments methods comprise receiving first agronomic data for a first geographic location comprising sensor data from agronomic sensors at the first geographic location; receiving first agronomic information for the first geographic location; and generating first predictive agronomic data for the first geographic location using the first agronomic data for the first geographic location and the first agronomic information for the first geographic location.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: A disclosed apparatus includes a converter for receiving a supply and regulating a load. The converter uses a gate driver that is controlled by a controller via a control loop. The control loop controls the converter in response to a feedback signal. The controller is located on a first integrated circuit and the gate driver is located on as second integrated circuit. A process geometry of the first integrated circuit is finer than a process geometry of the second integrated circuit.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Abstract: A converter for supplying a regulated voltage from an input to a load is disclosed. The converter supplies a regulated DC voltage from an input to a load using a power switch driven by a gate driver. It also includes a control loop for carrying a load condition signal and a control signal. The converter also includes a controller located on the control loop that generates the control signal based on the load signal. The controller is located on a first integrated circuit. The gate driver is located on a second integrated circuit. The load condition signal is encoded on the first integrated circuit and is decoded on the second integrated circuit.

Abstract: A converter for supplying a regulated voltage from an input to a load is disclosed. The converter supplies a regulated DC voltage from an input to a load using a power switch driven by a gate driver. It also includes a control loop for carrying a load condition signal and a control signal. The converter also includes a controller located on the control loop that generates the control signal based on the load signal. The controller is located on a first integrated circuit. The gate driver is located on a second integrated circuit. The load condition signal is encoded on the first integrated circuit and is decoded on the second integrated circuit.

Abstract: A converter for supplying a regulated voltage from an input to a load is disclosed. The converter supplies a regulated DC voltage from an input to a load using a power switch driven by a gate driver. It also includes a control loop for carrying a load condition signal and a control signal. The converter also includes a controller located on the control loop that generates the control signal based on the load signal. The controller is located on a first integrated circuit. The gate driver is located on a second integrated circuit. The load condition signal is encoded on the first integrated circuit and is decoded on the second integrated circuit.

Abstract: A disclosed apparatus includes a converter for receiving a supply and regulating a load. The converter uses a gate driver that is controlled by a controller via a control loop. The control loop controls the converter in response to a feedback signal. The controller is located on a first integrated circuit and the gate driver is located on as second integrated circuit. A process geometry of the first integrated circuit is finer than a process geometry of the second integrated circuit.

Abstract: Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.