Abstract: A cooling system for integrated circuit packaging of the conventional dual-in-line (DIP) type including a carrier heat sink plate which form web sections which engage the bodies of the DIP held side-by-side thereon. The plate is thermally and mechanically connected by means of a clamping device to a cooling frame in which a serpentine tubing carries coolant throughout spaced apart sections thereof, so that the heat generated by the DIP's is carried away by the heat sink plate into the frame sections where the coolant circulate. The DIP pins are electrically connected to a printed circuit board and to relatively flat flexible ribbon type printed circuit type cable the latter being clamped at each end into a standard connector which itself is clamped to an island printed circuit board having conductors thereon for connecting the DIP's to other electronic devices. Multiplicity of these DIP's so mounted in the cooling frame may be housed in the same console or housing along with other DIP islands as desired.

Abstract: A system for cooling high density integrated circuits for computer systems comprising a cooling frame having a plurality of the heat pipes spanning the space within the frame to which sub-islands are attached to form an island. Each sub-island comprises a printed circuit board on which are mounted connectors for mounting the integrated circuit package and printed circuit board heat sinks having posts which cooperate with hold down pressure clamps for clamping the integrated circuit packages into the connectors and to clamp the heat sink plates of the integrated circuit packages to the printed circuit board heat sinks. These posts also aid in clamping the sub-islands together by cooperating a heat pipe hold down clamp by which each sub-island is clamped to the frame and to the heat pipes both mechanically and thermally to maximize the heat transfer between the integrated circuit packages and the heat pipes.