Abstract: Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board.

Abstract: Electroplating apparatus and methods for rapid and efficient plating of printed circuit board and the like are disclosed. In accordance with the method, a printed circuit board is disclosed within a tank of electrolyte and caused to oscillate in the plane of the printed circuit board. On each side of the printed circuit board are a plurality of paddle assemblies which are rotated to maintain a high degree of turbulence in the electrolyte adjacent the printed circuit board. Ion replenishment for the electrolyte is provided by baskets filled with pieces of the material to be plated, in the embodiment disclosed the baskets themselves being rotatable and having the paddle assemblies integral therewith. Electrolyte circulation is maintained by pumps with the electrolyte being withdrawn from the tank for filtering and replenishment through manifolds in the walls separating the cells within which the paddle assemblies operate. Various alternate embodiments are described.

Abstract: The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain.

Abstract: Electroplating apparatus and methods for rapid and efficient plating of printed circuit board and the like are disclosed. In accordance with the method, a printed circuit board is disclosed within a tank of electrolyte and caused to oscillate in the plane of the printed circuit board. On each side of the printed circuit board are a plurality of paddle assemblies which are rotated to maintain a high degree of turbulence in the electrolyte adjacent the printed cirucit board. Ion replenishment for the electrolyte is provided by baskets filled with pieces of the material to be plated, in the embodiment disclosed the baskets themselves being rotatable and having the paddle assemblies integral therewith. Electrolyte circulation is maintained by pumps with the electrolyte being withdrawn from the tank for filtering and replenishment through manifolds in the walls separating the cells within which the paddle assemblies operate. Various alternate embodiments are described.

Abstract: Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board.

Abstract: The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain.

Abstract: Methods and apparatus for providing high and uniform processing rates for electroplating, deplating, etching and the like, substantially independent of the surface geometries of the article subjected to the process. In an electroplating application, the article to be plated is supported on a cathode so the electrolyte may be forcibly sprayed on the article from an array of spray nozzles adjacent the surface thereof. Intermixed with the array of spray nozzles may be a second array of openings providing suction to locally remove most of the sprayed electrolyte after impingment on the work piece. In this manner most of the spent electrolyte is removed from the work piece locally so that it is not available to flow down the work piece to shield the surface thereof from the spray of lower nozzles. One or more additional intermixed arrays of delivery ports may also be used to deliver such things as inert gases, brighteners, polishing media, air under pressure to increase agitation, etc.

Abstract: A practice hockey puck for use in individual practice on surfaces other than ice. The practice hockey puck body may be a standard hockey puck altered so as to have a plurality of headed pins disposed about the periphery of the two flat surfaces thereon. Headed members are also provided at the center of the two flat surfaces, with the heads thereof extending above the elevation of the heads of the members at the periphery of the flat surfaces so that the majority of the weight of the hockey puck is supported on these central members when resting on a flat surface. The puck is removably coupled to an elastic cord which in turn includes a fastening device at the opposite end thereof for fastening to a hockey stick. One section of the elastic cord may be provided with known and limited breakage characteristics so as to limit the maximum elastic energy which may be stored in the elastic cord to limit the springback of the puck.