Abstract: Methods and apparatus for providing fine line, high density multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator materil substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate, and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material having conductive circuit patterns embedded and integrally molded therein.

Abstract: Methods and apparatus for providing fine line, high density multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator material substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate, and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material having conductive circuit patterns embedded and integrally molded therein.