Patents by Inventor Peter P. Pronko
Peter P. Pronko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6787723Abstract: Methods for separating isotopes or chemical species of an element and causing enrichment of a desired isotope or chemical species of an element utilizing laser ablation plasmas to modify or fabricate a material containing such isotopes or chemical species are provided. This invention may be used for a wide variety of materials which contain elements having different isotopes or chemical species.Type: GrantFiled: February 28, 2002Date of Patent: September 7, 2004Assignee: The Regents of the University of MichiganInventors: Peter P. Pronko, Paul A. Vanrompay, Zhiyu Zhang
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Patent number: 6586696Abstract: The invention provides new methods for separating isotopes of an element and causing enrichment of a desired isotope of an element utilizing laser ablation plasmas to modify or fabricate a material containing such isotopes. This invention may be used for a wide variety of materials which contain elements having different isotopes.Type: GrantFiled: November 30, 2001Date of Patent: July 1, 2003Assignee: The Regents of the University of MichiganInventors: Peter P. Pronko, Paul A. Vanrompay, John Nees, Zhiyu Zhang
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Publication number: 20020166960Abstract: Methods for separating isotopes or chemical species of an element and causing enrichment of a desired isotope or chemical species of an element utilizing laser ablation plasmas to modify or fabricate a material containing such isotopes or chemical species are provided. This invention may be used for a wide variety of materials which contain elements having different isotopes or chemical species.Type: ApplicationFiled: February 28, 2002Publication date: November 14, 2002Inventors: Peter P. Pronko, Paul A. Vanrompay, Zhiyu Zhang
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Patent number: 5656186Abstract: In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (F.sub.th) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired.The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.Type: GrantFiled: April 8, 1994Date of Patent: August 12, 1997Assignee: The Regents of the University of MichiganInventors: Gerard A. Mourou, Detao Du, Subrata K. Dutta, Victor Elner, Ron Kurtz, Paul R. Lichter, Xinbing Liu, Peter P. Pronko, Jeffrey A. Squier
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Patent number: 5192523Abstract: A method of depositing a diamondlike carbon coating on a substrate. An ionized beam of pure methane or methane and hydrogen, and having an ion kinetic energy in the range of 500-1,000 eV is impinged on a substrate to deposit, thereon, a diamondlike carbon coating. Various substrates can be utilized, and various cleaning procedures are developed for use with the particular substrates to improve the adhesion of the diamondlike carbon coatings. The methane-hydrogen ratio and the operating pressure of the ionized gas can each be varied to vary the carbon-hydrogen ratio of the resulting diamondlike coating to thereby alter the characteristics of the coating.Type: GrantFiled: May 28, 1991Date of Patent: March 9, 1993Assignee: Universal Energy Systems, Inc.Inventors: Richard L. Wu, Peter P. Pronko
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Patent number: 5147808Abstract: A silicon on insulator structure and method of making the structure. A high purity, substantially defect free silicon wafer is the basis for forming a final thin silicon layer on an insulator layer, the silicon having substantially the same chemical and structural state as the starting silicon wafer. Dopant atoms of MeV energy range are implanted into the silicon wafer, the silicon wafer having an insulator layer coupled thereto; and an underlying silicon carrier wafer is coupled to the insulator. The implanted silicon wafer undergoes preferential etch stop removal of the silicon up to the implanted dopant layer, followed by selective removal of the dopant atom layer, leaving the desired high quality silicon layer on an insulator substrate.Type: GrantFiled: April 12, 1990Date of Patent: September 15, 1992Assignee: Universal Energy Systems, Inc.Inventor: Peter P. Pronko
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Patent number: 5136344Abstract: A silicon on insulator structure and method of making the structure. A high purity, substantially defect free silicon wafer is the basis for forming a final thin silicon layer on an insulator layer, the silicon having substantially the same chemical and structural state as the starting silicon wafer. Dopant atoms of MeV energy range are implanted into the silicon wafer, the silicon wafer haivng an insulator layer coupled thereto; and an underlying silicon carrier wafer is coupled to the insulator. The implanted silicon wafer undergoes preferential etch stop removal of the silicon up to the implanted dopant layer, followed by selective removal of the dopant atom layer, leaving the desired high quality silicon layer on an insulator substrate.Type: GrantFiled: November 26, 1990Date of Patent: August 4, 1992Assignee: Universal Energy Systems, Inc.Inventor: Peter P. Pronko
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Patent number: 4863810Abstract: A method of providing corrosion resistant substrates having an amorphous metallic alloy coating thereon. The method comprises depositing refractory and transition elements, such as Ni, Nb, Ti and Cr, onto the substrate to provide a crystalline metallic layer thereon which is then irradiated to convert the layer into an amorphous metallic coating on the substrate. The coated substrate displays a corrosion resistance which is at least about four orders of magnitude greater than for the uncoated substrate in both lN HNO.sub.3 and 0.1 N NaCl aqueous solutions.Type: GrantFiled: September 21, 1987Date of Patent: September 5, 1989Assignee: Universal Energy Systems, Inc.Inventors: Rabi S. Bhattacharya, Amarendra K. Rai, Peter P. Pronko, Charbel Raffoul
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Patent number: RE37585Abstract: In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired. The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.Type: GrantFiled: August 4, 1999Date of Patent: March 19, 2002Assignee: The Regents of the University of MichiganInventors: GĂ©rard Mourou, Detao Du, Subrata K. Dutta, Victor Elner, Ron Kurtz, Paul R. Lichter, Xinbing Liu, Peter P. Pronko, Jeffrey A. Squier