Abstract: A polarless surface mounting light emitting diode comprises a substrate; an upper surface of the substrate being etched with four independent metal thin film blocks; a lower surface of the substrate being formed with two independent metal thin film blocks; two ends of the substrate being formed with electroplated through holes; a plurality of metal thin films adhered upon the upper and lower surfaces of the substrate; two light emitting assemblies, each light emitting assembly being formed by a chip resistor and a chip light emitting diode; and a package layer. The connection of the polarless surface mounting light emitting diode of the present invention is not limited by the polarity. Any end of the polarless surface mounting light emitting diode can be connected to positive electrode or negative electrode.

Abstract: A polarless surface mounting light emitting diode comprises a substrate having; an upper surface of the substrate being etched with four independent metal thin film block; an lower surface of the substrate being formed with two independent metal thin film block; two ends of the substrate being formed with electroplating through holes; a plurality of metal thin films adhered upon the upper and lower surfaces of the substrate; at least one light emitting assembly, each light emitting assembly being formed by the chip resistor and the chip light emitting diode; and a package layer. The connection of the polarless surface mounting light emitting diode of the present invention is not limited by the polarity. Any end of the polarless surface mounting light emitting diode can be connected to positive electrode or negative electrode.