Patents by Inventor Peter Pietrangelo

Peter Pietrangelo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9029759
    Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: May 12, 2015
    Assignee: Nan Chang O-Film Optoelectronics Technology Ltd
    Inventors: Harpuneet Singh, Giles Humpston, Ellis Chau, Eddie Azuma, Peter Pietrangelo, Ocie Ward
  • Patent number: 9001268
    Abstract: A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: April 7, 2015
    Assignee: Nan Chang O-Film Optoelectronics Technology Ltd
    Inventors: Eddie Azuma, Chih Yen Liu, Emerson Yu, David Hsieh, Josh Tsai, Peter Pietrangelo
  • Publication number: 20140043525
    Abstract: A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 13, 2014
    Inventors: Eddie Azuma, Chih Yen Liu, Emerson Yu, David Hsieh, Josh Tsai, Peter Pietrangelo
  • Publication number: 20130270419
    Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 17, 2013
    Applicant: DIGITALOPTICS CORPORATION
    Inventors: Harpuneet Singh, Giles Humpston, Ellis Chau, Eddie Azuma, Peter Pietrangelo, Ocie Ward