Patents by Inventor Peter Prankh

Peter Prankh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11373804
    Abstract: Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: June 28, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann
  • Patent number: 11282822
    Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: March 22, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann
  • Publication number: 20210242187
    Abstract: Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
    Type: Application
    Filed: January 14, 2019
    Publication date: August 5, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann
  • Publication number: 20210090798
    Abstract: Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.
    Type: Application
    Filed: January 30, 2019
    Publication date: March 25, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Wilhelm Meyrath, Franz Pfleger, Peter Prankh, Jörg Strogies, Bernd Müller, Klaus Wilke, Matthias Heimann