Abstract: The present invention relates to polymer moldings with conductive, especially electrically conductive, structures on the surface, and to a process for production of these polymer moldings. A further aspect of the invention relates to the use of a device for production of the conductive, especially of the electrically conductive, structures on the surface of the polymer molding. The invention additionally relates to the use of an adhesive comprising carbon nanotubes (CNTs) for electrically conductive bonding of an electronic component to another electrically conductive component or molding. The invention additionally relates to a circuit board arrangement comprising at least one circuit board with at least one electrically conductive track. The at least one electrically conductive track preferably comprises a metal layer and/or at least one electronic component. The invention also relates to processes for production of the inventive circuit board arrangements.

Abstract: The invention relates to a polymer blend composed of a polypropylene and/or of a polypropylene copolymer and of another polymer which is incompatible with the polypropylene and/or with the polypropylene copolymer. The polymer is obtained via mixing of the melts of the two polymers with high energy input. After cooling, and also after remelting and further processing via, for example, injection molding, it shows no separation of the phases. The invention further relates to a polymer blend which can be obtained by the inventive process, and also to a molding composed of the polymer blend.

Abstract: A process is disclosed for recycling plastic materials. The previously sorted plastic material wastes are comminuted, mixed, melted and homogenized during a first step, and the raw materials thus recovered are immediately stocked in a storage chamber (12) or buffer reservoir, then supplied to an injection and moulding device (13). During their temporary storage, the raw materials are exposed if necessary to a regulated temperature.