Patents by Inventor Peter R. Levey
Peter R. Levey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10273591Abstract: A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.Type: GrantFiled: January 20, 2013Date of Patent: April 30, 2019Assignee: Rohm and Haas Electronic Materials LLCInventor: Peter R. Levey
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Publication number: 20160319434Abstract: UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: ApplicationFiled: November 4, 2013Publication date: November 3, 2016Inventors: Peter R. LEVEY, Nathaniel E. BRESE, Neil D. BROWN, Stanley J. JASNE
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Patent number: 9187838Abstract: Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface.Type: GrantFiled: October 21, 2013Date of Patent: November 17, 2015Inventor: Peter R. Levey
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Publication number: 20140110266Abstract: Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface.Type: ApplicationFiled: October 21, 2013Publication date: April 24, 2014Inventor: Peter R. LEVEY
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Publication number: 20140065411Abstract: UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: ApplicationFiled: November 4, 2013Publication date: March 6, 2014Inventors: Peter R. LEVEY, Nathaniel E. BRESE, Neil D. BROWN, Stanley J. JASNE
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Patent number: 8575057Abstract: UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: GrantFiled: November 28, 2005Date of Patent: November 5, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Nathaniel E. Brese, Neil D. Brown, Stanley J. Jasne
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Publication number: 20120177821Abstract: Catalytic nanoparticles are coated with a layer of an amphoteric surfactant to stabilize the nanoparticles for electroless metal plating.Type: ApplicationFiled: July 18, 2011Publication date: July 12, 2012Applicant: Rohm and Haas Electronic Materials LLCInventor: Peter R. LEVEY
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Patent number: 7842636Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: GrantFiled: January 14, 2009Date of Patent: November 30, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Nathaniel E. Brese
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Patent number: 7825058Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: GrantFiled: January 14, 2009Date of Patent: November 2, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Nathaniel E. Brese
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Publication number: 20090253573Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: ApplicationFiled: January 14, 2009Publication date: October 8, 2009Applicant: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Nathaniel E. Brese
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Publication number: 20090192029Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: ApplicationFiled: January 14, 2009Publication date: July 30, 2009Applicant: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Nathaniel E. Brese
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Patent number: 7510993Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.Type: GrantFiled: June 24, 2004Date of Patent: March 31, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Nathaniel E. Brese
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Patent number: 7465384Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.Type: GrantFiled: February 28, 2006Date of Patent: December 16, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Neil D. Brown
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Patent number: 6923899Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.Type: GrantFiled: March 5, 2003Date of Patent: August 2, 2005Assignee: Shipley Company, L.L.C.Inventors: Neil D. Brown, Angelo Chirafisi, Peter R. Levey
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Publication number: 20030226759Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.Type: ApplicationFiled: March 5, 2003Publication date: December 11, 2003Applicant: Shipley Company, L.L.C.Inventors: Neil D. Brown, Angelo Chirafisi, Peter R. Levey