Abstract: A foundry moulding composition comprising (a) a granular refractory material, and (b) from 0.5% to 8% based on the weight of the refractory material of a binder comprising (i) an aqueous solution of a potassium alkali phenol-formaldehyde resin, said aqueous solution having a solids content of from 50% to 75% and said resin having a weight average molecular weight (M.sub.w) of from 600 to 1500, a formaldehyde:phenol molar ratio of from 1.2:1 to 2.6:1 and a potassium hydroxide:phenol molar ratio of from 0.2:1 to 1.2:1 and (ii) at least one silane in an amount of from 0.05% to 3% based on the weight of said aqueous solution, said binder being curable by contact therewith of from 5% to 60% based on the weight of said aqueous solution of a C.sub.1-3 alkyl formate.

Abstract: A foundry moulding composition comprising (a) a granular refractory material, and (b) from 0.5% to 8% based on the weight of the refractory material of a binder comprising (i) an aqueous solution of a potassium alkali phenol-formaldehyde resin, said aqueous solution having a solids content of from 50% to 75% and said resin having a weight average molecular weight (M.sub.w) of from 600 to 1500, a formaldehyde:phenol molar ratio of from 1.2:1 to 2.6:1 and a potassium hydroxide:phenol molar ratio of from 0.2:1 to 1.2:1 and (ii) at least one silane in an amount of from 0.05% to 3% based on the weight of said aqueous solution, said binder being curable by contact therewith of from 5% to 60% based on the weight of said aqueous solution of a C.sub.1-3 alkyl formate.