Abstract: An apparatus for memory management a high-speed fabric controller and a memory controller connected between a high-speed memory and a processor. The memory controller is configured to control processor access to the high-speed memory over a memory bus between the processor and the high-speed memory. The apparatus includes a high-speed data connection between the memory controller and the high-speed fabric controller and a data connection between a tier of persistent data storage and the high-speed fabric controller. The high-speed fabric controller is configured to control data transfers between the tier of persistent data storage over and the high-speed memory independent of the processor.

Abstract: An apparatus for memory management a high-speed fabric controller and a memory controller connected between a high-speed memory and a processor. The memory controller is configured to control processor access to the high-speed memory over a memory bus between the processor and the high-speed memory. The apparatus includes a high-speed data connection between the memory controller and the high-speed fabric controller and a data connection between a tier of persistent data storage and the high-speed fabric controller. The high-speed fabric controller is configured to control data transfers between the tier of persistent data storage over and the high-speed memory independent of the processor.

Abstract: An integrated circuit (IC) that includes a semiconductor die in an IC package. The semiconductor die includes an electrical endpoint. The IC also includes a pad affixed to the semiconductor die. The pad is characterized by a capacitance and is coupled to the electrical endpoint. The IC also includes a bond wire coupling the pad to an IC package pin. The bond wire is an inductor characterized by an inductance. The inductance is configured to decrease signal degradation caused by the capacitance of the pad on electrical signals transmitted between the pin and the electrical endpoint of the semiconductor die.

Abstract: A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.

Abstract: A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.

Abstract: A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.

Abstract: Testing an electrical component, the component including a printed circuit board (‘PCB’) with a number of traces, the traces organized in pairs with each trace of a pair carrying current in opposite directions and separated from one another by a substrate layer of the PCB, where testing of the electrical component includes: dynamically and iteratively until a present impedance for a pair of traces of the component is greater than a predetermined threshold impedance: increasing, by an impedance varying device at the behest of a testing device, magnetic field strength of a magnetic field applied to the pair of traces by the impedance varying device, including increasing the present impedance of the pair of traces; measuring, by the testing device, one or more operating parameters; and recording, by the testing device, the measurements of the operating parameters.

Abstract: A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.

Abstract: An integrated circuit (IC) that includes a semiconductor die in an IC package. The semiconductor die includes an electrical endpoint. The IC also includes a pad affixed to the semiconductor die. The pad is characterized by a capacitance and is coupled to the electrical endpoint. The IC also includes a bond wire coupling the pad to an IC package pin. The bond wire is an inductor characterized by an inductance. The inductance is configured to decrease signal degradation caused by the capacitance of the pad on electrical signals transmitted between the pin and the electrical endpoint of the semiconductor die.

Abstract: Embodiments of the invention include a common mode cancellation circuit and method for correcting signal skew in a differential circuit. According to one embodiment, an op amp circuit is used to correct the mismatch between transmission line lengths in the differential circuit. The CMCC can be embodied as an ASIC and added on to an existing differential signaling systems to correct and compensate for board wiring skew or other causes of phase misalignment. The result is restoration of the cross-over intersection of the plus and minus signals of the differential pair closer to the common voltage level point, as if the signals had been in phase.

Abstract: Embodiments of the invention include a common mode cancellation circuit and method for correcting signal skew in a differential circuit. According to one embodiment, an op amp circuit is used to correct the mismatch between transmission line lengths in the differential circuit. The CMCC can be embodied as an ASIC and added on to an existing differential signaling systems to correct and compensate for board wiring skew or other causes of phase misalignment. The result is restoration of the cross-over intersection of the plus and minus signals of the differential pair closer to the common voltage level point, as if the signals had been in phase.

Abstract: Testing an electrical component, the component including a printed circuit board (‘PCB’) with a number of traces, the traces organized in pairs with each trace of a pair carrying current in opposite directions and separated from one another by a substrate layer of the PCB, where testing of the electrical component includes: dynamically and iteratively until a present impedance for a pair of traces of the component is greater than a predetermined threshold impedance: increasing, by an impedance varying device at the behest of a testing device, magnetic field strength of a magnetic field applied to the pair of traces by the impedance varying device, including increasing the present impedance of the pair of traces; measuring, by the testing device, one or more operating parameters; and recording, by the testing device, the measurements of the operating parameters.

Abstract: A self-adaptive voltage regulator for a phase-locked loop is disclosed. The phase-locked loop includes a phase detector, a charge pump, a low pass filter, and a voltage control oscillator, wherein the low pass filter inputs a control voltage to a voltage controlled oscillator for generation of an output clock. According to the method and system disclosed herein, the self-adaptive voltage regulator is coupled to an output of the low pass filter for sensing the control voltage during normal operation of the phase-locked loop, and for dynamically adjusting the supply voltage, which is input to the voltage controlled oscillator in response to the control voltage, such that the phase-locked loop maintains the control voltage within a predefined range of a reference voltage.