Abstract: Systems for handling discs, such as semiconductor wafers and the like, using both stationary and movable air track assemblies include an elongate track member, a flat surface formed to extend along the underside of the track member, ports disposed along the flat undersurface for the discharge of air at an angle to the vertical, and provision for discharging a sufficient flow of air from the ports to create a differential in the air pressure above and below the discs so as to lift the discs toward the flat undersurface as a result of the air flow. The angle has a sufficient horizontal vectorial component to urge the discs along the flat undersurface of the track member in the direction of such component. In one embodiment, the air track member extends between a pair of holders which respectively supply and receive discs carried by the track member. The discs may be carried to a predetermined fixed point, released, and subsequently retrieved from the same position.

Abstract: An apparatus is provided for transferring semiconductor wafers from one conveying or transport mechanism to another in a manner that substantially reduces wafer damage. The apparatus comprises first and second sensors; first, second and third rollers; a motor with a drive shaft coupled to the first and second rollers for applying a rotational force thereto; and a pneumatic unit coupled to a movable platform on which the rollers are mounted and operable for applying a lifting force to or removing a lifting force from the movable platform. The rollers are mounted parallel to and coplanar with each other and are positionable above or below the belts of a two-belt conveyor mechanism, the first roller being disposed for vertical movement between the belts of the conveyor mechanism, and the second and third rollers being coupled by two belts forming a transport mechanism for transporting wafers to or from the conveyor mechanism.