Abstract: A surgical microscope includes an optical assembly to image an object plane with a microscope main objective system, through which a first stereoscopic partial beam path with a first optical axis and a second stereoscopic partial beam path with a second optical axis pass. An illumination device includes a light source assembly to provide illumination light in a luminous plane, with a radiant field stop, and an illumination optical unit which at least partially images a luminous object arranged in the luminous plane in the illumination beam path into a luminous image plane located in the microscope main objective system or for the vertical distance z of which from the microscope main objective system on the side facing the object region or the side facing away from the object region, in relation to a focal length f of the microscope main objective system, the following applies: z/f<10%.

Abstract: Exemplary methods of coating a metal-containing component are described. The methods are developed to increase corrosion resistance and improve coating adhesion to a metal substrate. The methods include forming a bonding layer on a metal substrate, where the bonding layer includes an oxide of a metal in the metal substrate. The coating methods further include depositing a stress buffer layer on the bonding layer, where the stress buffer layer is characterized by a stress buffer layer coefficient of thermal expansion (CTE) that is less than a metal substrate CTE and a bonding layer CTE. The coating methods also include depositing an environmental barrier layer on the stress buffer layer, where a ratio of the metal substrate CTE to an environmental barrier layer CTE is greater than or about 20:1, and where the environmental barrier layer includes silicon oxide. The metal-containing components may be used in fabrication equipment for electronic devices.

Abstract: Methods of refining palm oil in order to produce a refined, bleached and deodorized palm oil with reduced level of 3-monochloropropane-1, 2-diol (3-MCPD) ester are disclosed. The methods may include premixing a palm oil with an acid to chelate metals and form a reaction mixture, and subjecting the reaction mixture to hydrodynamic cavitation mixing for less than 1 second.

Abstract: Exemplary methods of coating a metal-containing component are described. The methods are developed to increase corrosion resistance and improve coating adhesion to a metal substrate. The methods include forming a bonding layer on a metal substrate, where the bonding layer includes an oxide of a metal in the metal substrate. The coating methods further include depositing a stress buffer layer on the bonding layer, where the stress buffer layer is characterized by a stress buffer layer coefficient of thermal expansion (CTE) that is less than a metal substrate CTE and a bonding layer CTE. The coating methods also include depositing an environmental barrier layer on the stress buffer layer, where a ratio of the metal substrate CTE to an environmental barrier layer CTE is greater than or about 20:1, and where the environmental barrier layer includes silicon oxide. The metal-containing components may be used in fabrication equipment for electronic devices.

Abstract: Substrate support assembly and methods of making such substrate support assemblies are provided. Substrate support assemblies include an electrostatic chuck body defining a substrate support surface, a support stem coupled with the electrostatic chuck body, and an electrode embedded within the electrostatic chuck body. Substrate support surfaces exhibit a resistivity of 1×108 ?-cm to 1×1011 ?-cm at a temperature of greater than 650° C. Substrate support surfaces can include a composite ceramic material having a base dielectric material and a second dielectric material having an electrical resistivity at least about two times higher than an electrical resistivity of the base dielectric material at a temperature of greater than 650° C.

Abstract: Exemplary deposition methods may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include striking a first plasma in the processing region, the first plasma including energetic hydrogen species. The method may include exposing the powder to the energetic hydrogen species in the processing region. The method may include chemically reducing the powder through a reaction of the powder with the energetic hydrogen species. The method may include removing process effluents including unreacted hydrogen from the processing region. The method may also include forming a layer of material on grains of the powder within the processing region.

Abstract: The present disclosure generally relates to gas inject apparatus for a process chamber for processing of semiconductor substrates. The gas inject apparatus include one or more gas injectors which are configured to be coupled to the process chamber. Each of the gas injectors are configured to receive a process gas and distribute the process gas across one or more gas outlets. The gas injectors include a plurality of pathways, a fin array, and a baffle array. The gas injectors are individually heated. A gas mixture assembly is also utilized to control the concentration of process gases flown into a process volume from each of the gas injectors. The gas mixture assembly enables the concentration as well as the flow rate of the process gases to be controlled.

Abstract: Embodiments described herein include processes and apparatuses relate to epitaxial deposition. A method for epitaxially depositing a material is provided and includes positioning a substrate on a substrate support surface of a susceptor within a process volume of a chamber body, where the process volume contains upper and lower chamber regions. The method includes flowing a process gas containing one or more chemical precursors from an upper gas inlet on a first side of the chamber body, across the substrate, and to an upper gas outlet on a second side of the chamber body, flowing a purge gas from a lower gas inlet on the first side of the chamber body, across the lower surface of the susceptor, and to a lower gas outlet on the second side of the chamber body, and maintaining a pressure of the lower chamber region greater than a pressure of the upper chamber region.

Abstract: Exemplary deposition methods may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include striking a first plasma in the processing region, the first plasma including energetic hydrogen species. The method may include exposing the powder to the energetic hydrogen species in the processing region. The method may include chemically reducing the powder through a reaction of the powder with the energetic hydrogen species. The method may include removing process effluents including unreacted hydrogen from the processing region. The method may also include forming a layer of material on grains of the powder within the processing region.

Abstract: The present disclosure generally relates to a process chamber for processing of semiconductor substrates. The process chamber includes an upper lamp assembly, a lower lamp assembly, a substrate support, an upper window disposed between the substrate support and the upper lamp assembly, a lower window disposed between the lower lamp assembly and the substrate support, an inject ring, and a base ring. Each of the upper lamp assembly and the lower lamp assembly include vertically oriented lamp apertures for the placement of heating lamps therein. The inject ring includes gas injectors disposed therethrough and the base ring includes a substrate transfer passage, a lower chamber exhaust passage, and one or more upper chamber exhaust passages. The gas injectors are disposed over the substrate transfer passage and across from the lower chamber exhaust passage and the one or more upper chamber exhaust passages.

Abstract: A reflector and processing chamber having the same are described herein. In one example, a reflector is provided that includes cylindrical body, a cooling channel, and a reflective coating. The cylindrical body has an upper surface and a lower surface. The lower surface has a plurality of concave reflector structures disposed around a centerline of the cylindrical body. The cooling channel disposed in or on the cylindrical body. The reflective coating is disposed on the plurality of concave reflector structures.

Abstract: The present disclosure generally relates to a process chamber for processing of semiconductor substrates. The process chamber includes an upper lamp assembly, a lower lamp assembly, a susceptor, an upper window disposed between the substrate support and the upper lamp assembly, a lower window disposed between the lower lamp assembly and the substrate support, an inject ring, and a base ring. The susceptor includes a movement assembly. The movement assembly includes a bearing feedthrough assembly. The bearing feedthrough assembly is a ferrofluidic feedthrough assembly and functions as a ferrofluidic bearing. The bearing feedthrough assembly includes a shaft coupled to the support shaft. The shaft is rotated within the bearing feedthrough assembly. The bearing feedthrough assembly is combined with a first linear spline and a second linear spline.

Abstract: The present disclosure generally relates to gas inject apparatus for a process chamber for processing of semiconductor substrates. The gas inject apparatus include one or more gas injectors which are configured to be coupled to the process chamber. Each of the gas injectors are configured to receive a process gas and distribute the process gas across one or more gas outlets. The gas injectors include a plurality of pathways, a fin array, and a baffle array. The gas injectors are individually heated. A gas mixture assembly is also utilized to control the concentration of process gases flown into a process volume from each of the gas injectors. The gas mixture assembly enables the concentration as well as the flow rate of the process gases to be controlled.

Abstract: A laser-surgical apparatus includes a laser emitting laser light with a narrowband wavelength distribution, a digital image sensor or a plurality of digital image sensors that separately record(s) different color channels that represent mutually different spectral wavelength distributions with in each case one maximum corresponding to a specific spectral color and produce(s) separate pieces of image information for the individual color channels, and a graphics module for combining the separate pieces of image information into one color image. In addition, it includes a manipulation module for suppressing the laser light in the color image, which makes it possible to electronically manipulate the pieces of image information of the color channel the spectral wavelength distribution of which has the largest overlap with the narrowband wavelength distribution of the laser light before the separate pieces of image information are combined or during the combining of the separate pieces of image information.

Abstract: A reflector and processing chamber having the same are described herein. In one example, a reflector is provided that includes cylindrical body, a cooling channel, and a reflective coating. The cylindrical body has an upper surface and a lower surface. The lower surface has a plurality of concave reflector structures disposed around a centerline of the cylindrical body. The cooling channel disposed in or on the cylindrical body. The reflective coating is disposed on the plurality of concave reflector structures.

Abstract: Disclosed is a slit valve gate. The slit valve gate includes a base portion configured to couple to a slit valve actuator. The slit valve gate further includes a seal portion coupled to the base portion. The seal portion is configured to create an airtight seal between the slit valve gate and a sealing surface of a slit valve opening. The slit valve gate further includes a clamp portion coupled to the base portion. The clamp portion retains the seal portion at least partially between the clamp portion and the base portion.

Abstract: Disclosed is a slit valve gate. The slit valve gate includes a base portion configured to couple to a slit valve actuator. The slit valve gate further includes a seal portion coupled to the base portion. The seal portion is configured to create an airtight seal between the slit valve gate and a sealing surface of a slit valve opening. The slit valve gate further includes a clamp portion coupled to the base portion. The clamp portion retains the seal portion at least partially between the clamp portion and the base portion.

Abstract: A mass flow controller assembly includes a housing defining a cavity, a plurality of internal passages, a first inlet, a first outlet, a second inlet, and a second outlet. A valve is connected to the housing, has an inlet fluidly coupled to the second outlet of the housing and an outlet fluidly coupled to the second inlet of the housing. The valve is configured to control fluid flow from the second outlet of the housing to the second inlet of the housing. A microelectromechanical (MEMS) Coriolis flow sensor is arranged in the cavity, includes an inlet fluidly coupled by at least one of the plurality of internal passages to the first inlet of the housing and is configured to measure at least one of a mass flow rate and density of fluid flowing through the MEMS Coriolis flow sensor. An outlet of the MEMS Coriolis flow sensor is fluidly coupled by at least one of the plurality of internal passages to the second outlet of the housing.

Abstract: A surgical microscope includes an optical assembly to image an object plane with a microscope main objective system, through which a first stereoscopic partial beam path with a first optical axis and a second stereoscopic partial beam path with a second optical axis pass. An illumination device includes a light source assembly to provide illumination light in a luminous plane, with a radiant field stop, and an illumination optical unit which at least partially images a luminous object arranged in the luminous plane in the illumination beam path into a luminous image plane located in the microscope main objective system or for the vertical distance z of which from the microscope main objective system on the side facing the object region or the side facing away from the object region, in relation to a focal length f of the microscope main objective system, the following applies: z/f<10%.

Abstract: An apparatus for the separation of dry matter and liquid from a medium includes: a plurality of press rollers and at least one pore roller, at least one separation chamber for receiving the medium, and at least one filtrate chamber defined in cross section by press rollers and the at least one pore roller. The apparatus is configured for establishing a relative negative pressure inside the pore roller interior, such that liquid in the medium is sucked into the pore roller interior, and for roller rotation such that during separation operation dry matter of the medium initially passes between the pore roller and a press roller when transferring from the separation chamber to the filtrate chamber, and subsequently passes between two press rollers, when exiting from the filtrate chamber.