Abstract: A transformer includes a sequence of insulating layers layered transversely to a common plane, and a plurality of at least two galvanically separated circuits. Each circuit has at least one conductor winding, and a common magnetic core only partially surrounding the layered sequence and acting on the number of the at least two circuits. Each conductor winding is disposed on a respective one of the layers and extends parallel to the common plane. The core optionally has a core portion extending parallel to the common plane and bounds the layered sequence to one side.

Abstract: A method for manufacturing an electronic control unit includes providing a printed circuit board with at least one electric component attached thereon. The method includes arranging a lower layer of thermal interface material on top of the electric component and arranging an integrated heat spreader on top of the lower layer. The method includes determining the distance of the top surface of the integrated heat spreader perpendicular to the printed circuit board and arranging an upper layer of thermal interface material on the top surface of the integrated heat spreader. A layer thickness of the upper layer is selected based on the determined distance. The method includes arranging a heat sink with a contact surface such that the contact surface contacts the upper layer.

Abstract: The specification provides arrangements including an electronic controller unit, ECU, comprising a heatsink, a first printed circuit board, PCB; and a second printed circuit board, PCB. A plurality of components are provided located on said PCBs. The heatsink is arranged between the first and second PCBs and is thermally coupled to the components to provide cooling. The heatsink further comprises an aperture extending through a body of the heatsink. The first PCB is directly connected to the second PCB by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

Abstract: An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

Abstract: A rack assembly unit for mounting a control unit to a vehicle rack system is provided; a rack chassis and a tray are configured to receive the control unit for coupling to a vehicle system. The tray is movably coupled to the rack chassis at a coupling mechanism, which provides for movement of the tray relative to the rack chassis between open and closed positions. At the open position, the tray is spaced apart from rack chassis to facilitate user access to the tray and receiving the control unit therein. At the closed position, the tray is located fully inserted relative to the rack chassis and such that the control unit located in the tray is provided at a control unit operating position thermally coupled to a cold plate of a cooling system to provide for cooling of components of the control unit.

Abstract: A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

Abstract: A method and apparatus for applying viscous liquid marking substance in which the marking substance is applied in small amounts at spaced-apart locations to a moving web from the open mouth of a narrow channel which intermittently contacts the web, the marking substance passing from a supply thereof into and filling the channel and being collected there during the intervals between successive contacts of the channel mouth with the web.