Patents by Inventor Peter Robert Ivett

Peter Robert Ivett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4023725
    Abstract: A method of bonding a semiconductor body to a supporting member where the whole back face of the semiconductor body is covered with a thin evaporated layer of chromium or titanium, which layer is then covered with a thin evaporated layer of rhodium, platinum or palladium, which is in turn bonded by a film of solder to the supporting member.
    Type: Grant
    Filed: March 3, 1975
    Date of Patent: May 17, 1977
    Assignee: U.S. Philips Corporation
    Inventors: Peter Robert Ivett, Christopher Tooth, Leslie Charles Davis