Abstract: A testing environment is provided in which both accelerometers and magnetometers can be tested in parallel, thereby decreasing the total cycle time for testing a semiconductor device package containing those devices. Embodiments of the present invention can also be configured to test singulated packages, thereby providing a tested and trimmed product that more accurately reflects the package delivered to the customer. In one embodiment, a series of device test locations within a testing region are configured to provide a known relationship with multiple fields of force. The device test locations are configured to provide sensitivity data from the packaged sensors in response to the directional forces. Embodiments provide a mechanism to transport the sensor packages from a device test location to a next device test location.

Abstract: A method of testing a device includes setting a potential of a cap terminal of the device to a first voltage, setting a potential of a self test plate of the device to a testing voltage, and detecting a first displacement of a proof mass of the device when the cap terminal is set to the first voltage and the self test plate is set to the testing voltage. The method includes setting a potential of the cap terminal of the device to a second voltage, detecting a second displacement of the proof mass of the device when the cap terminal is set to the second voltage and the self test plate is set to the testing voltage, and comparing the first displacement and the second displacement to evaluate an electrical connection between the cap terminal and a cap of the device.

Abstract: A method of testing a device includes setting a potential of a cap terminal of the device to a first voltage, setting a potential of a self test plate of the device to a testing voltage, and detecting a first displacement of a proof mass of the device when the cap terminal is set to the first voltage and the self test plate is set to the testing voltage. The method includes setting a potential of the cap terminal of the device to a second voltage, detecting a second displacement of the proof mass of the device when the cap terminal is set to the second voltage and the self test plate is set to the testing voltage, and comparing the first displacement and the second displacement to evaluate an electrical connection between the cap terminal and a cap of the device.

Abstract: A testing environment is provided in which both accelerometers and magnetometers can be tested in parallel, thereby decreasing the total cycle time for testing a semiconductor device package containing those devices. Embodiments of the present invention can also be configured to test singulated packages, thereby providing a tested and trimmed product that more accurately reflects the package delivered to the customer. In one embodiment, a series of device test locations within a testing region are configured to provide a known relationship with multiple fields of force. The device test locations are configured to provide sensitivity data from the packaged sensors in response to the directional forces. Embodiments provide a mechanism to transport the sensor packages from a device test location to a next device test location.

Abstract: An integrated circuit includes a transducer and transducer circuitry and additional elements useful in testing the transducer and transducer circuitry. A first power supply terminal and a second power supply terminal are for being directly connected to an external power supply terminal. A power bus is connected to the first power supply terminal. A logic function is for determining if the second power supply terminal is receiving power and if an automatic calibration test of the transducer and transducer circuitry has been run. An automatic calibration is for running an automatic calibration test on the transducer and transducer circuitry if the logic means determines that the second power supply terminal is receiving power and the automatic calibration test of the transducer and transducer circuitry has not been run.

Abstract: A microelectromechanical systems (MEMS) device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (58) extends from the movable element (22). The secondary structure (58) includes a secondary mass (70) and a spring (68) interconnected between the movable element (22) and the mass (70). The spring (68) is sufficiently stiff to prevent movement of the mass (70) when the movable element (22) is subjected to force within a sensing range of the device (20). However, the spring (68) deflects when the device (20) is subjected to mechanical shock (86), and the spring (68) rebounds thus causing the mass (70) to impact the movable element (22) in a direction that would be likely to dislodge a potentially stuck movable element (22).

Abstract: A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).

Abstract: An integrated circuit includes a transducer and transducer circuitry and additional elements useful in testing the transducer and transducer circuitry. A first power supply terminal and a second power supply terminal are for being directly connected to an external power supply terminal. A power bus is connected to the first power supply terminal. A logic function is for determining if the second power supply terminal is receiving power and if an automatic calibration test of the transducer and transducer circuitry has been run. An automatic calibration is for running an automatic calibration test on the transducer and transducer circuitry if the logic means determines that the second power supply terminal is receiving power and the automatic calibration test of the transducer and transducer circuitry has not been run.

Abstract: An integrated circuit includes a transducer and transducer circuitry and additional elements useful in testing the transducer and transducer circuitry. A first power supply terminal and a second power supply terminal are for being directly connected to an external power supply terminal. A power bus is connected to the first power supply terminal. A logic function is for determining if the second power supply terminal is receiving power and if an automatic calibration test of the transducer and transducer circuitry has been run. An automatic calibration is for running an automatic calibration test on the transducer and transducer circuitry if the logic means determines that the second power supply terminal is receiving power and the automatic calibration test of the transducer and transducer circuitry has not been run.

Abstract: A microelectromechanical systems (MEMS) device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (58) extends from the movable element (22). The secondary structure (58) includes a secondary mass (70) and a spring (68) interconnected between the movable element (22) and the mass (70). The spring (68) is sufficiently stiff to prevent movement of the mass (70) when the movable element (22) is subjected to force within a sensing range of the device (20). However, the spring (68) deflects when the device (20) is subjected to mechanical shock (86), and the spring (68) rebounds thus causing the mass (70) to impact the movable element (22) in a direction that would be likely to dislodge a potentially stuck movable element (22).

Abstract: A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).

Abstract: An integrated circuit includes a transducer and transducer circuitry and additional elements useful in testing the transducer and transducer circuitry. A first power supply terminal and a second power supply terminal are for being directly connected to an external power supply terminal. A power bus is connected to the first power supply terminal. A logic function is for determining if the second power supply terminal is receiving power and if an automatic calibration test of the transducer and transducer circuitry has been run. An automatic calibration is for running an automatic calibration test on the transducer and transducer circuitry if the logic means determines that the second power supply terminal is receiving power and the automatic calibration test of the transducer and transducer circuitry has not been run.

Abstract: A three-axis MEMS transducer featuring a caddie-corner proof mass comprises a planar main body portion of conductive material and a planar extra mass caddie-corner feature. The main body portion includes a width, length, and at least four side edges. An x-axis sense direction is defined from a first side edge to an opposite first side edge and a y-axis sense direction is defined from a second side edge to an opposite second side edge. The x-axis sense direction is perpendicular to the y-axis sense direction. The main body portion further includes at least two corners. The caddie-corner feature is positioned about at least one of the two corners of the main body portion. The caddie-corner feature and the main body portion comprise a single proof mass having a z-sense pivot axis disposed at an angle of ninety degrees to a diagonal extending from the caddie-corner feature to an opposite corner of the main body portion.

Abstract: A three-axis MEMS transducer featuring a caddie-corner proof mass comprises a planar main body portion of conductive material and a planar extra mass caddie-corner feature. The main body portion includes a width, length, and at least four side edges. An x-axis sense direction is defined from a first side edge to an opposite first side edge and a y-axis sense direction is defined from a second side edge to an opposite second side edge. The x-axis sense direction is perpendicular to the y-axis sense direction. The main body portion further includes at least two corners. The caddie-corner feature is positioned about at least one of the two corners of the main body portion. The caddie-corner feature and the main body portion comprise a single proof mass having a z-sense pivot axis disposed at an angle of ninety degrees to a diagonal extending from the caddie-corner feature to an opposite corner of the main body portion.

Abstract: A device (100) may use one or more conductive elements (112) to electrically couple a substrate (116) and a cap (114). In one embodiment, an acceleration sense element may be formed on the substrate (116), and the cap (114) may be used to provide hermetic protection to the acceleration sense element. In one embodiment, conductive elements (112) may be formed by dispensing conductive die attach material. Wire bonds (e.g. 322) bonded to bond pads (e.g. 332) on the substrate (e.g. 316) may be used to couple substrate (116), the conductive element pad (335), and the cap (114), to a desired predetermined potential.

Abstract: A device (100) may use one or more conductive elements (112) to electrically couple a substrate (116) and a cap (114). In one embodiment, an acceleration sense element may be formed on the substrate (116), and the cap (114) may be used to provide hermetic protection to the acceleration sense element. In one embodiment, conductive elements (112) may be formed by dispensing conductive die attach material. Wire bonds (e.g. 322) bonded to bond pads (e.g. 332) on the substrate (e.g. 316) may be used to couple substrate (116), the conductive element pad (335), and the cap (114), to a desired predetermined potential.