Abstract: An integrated circuit device includes a thin semiconductor layer disposed on a surface of a wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer, and a node formed on the semiconductor layer that provides an optoelectronic interface to an axial optical data bus for high-speed optical interconnectivity between the WSI circuits and other external devices interconnected to the optical data bus.

Abstract: A wafer-scale module includes a plurality of stacked wafers, each having a thin semiconductor layer disposed on a surface of the wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer and a plurality of nodes formed on the semiconductor layer. Each node provides an optoelectronic interface to an axial optical waveguide for high-speed optical interconnectivity between the WSI circuits and other integrated wafer circuit devices of the stack. A top plate is included and is disposed on the plurality of stacked wafer devices. A base plate, included for purposes of thermal dissipation, is disposed opposite the top plate such that the plurality of stacked wafers are sandwiched between the top plate and the base plate and all are assembled.