Abstract: A hardened optical platform includes a hardened enclosure including a door that when closed environmentally seals the hardened enclosure; a first set including one of more modules; a second set including one or more modules arranged substantially perpendicular to the first set; and high-speed cabling interconnecting the first set to the second set, wherein the hardened optical platform is passively cooled with the hardened enclosure and the door being weatherproof thereby having no airflow internally from a surrounding environment.

Abstract: A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

Abstract: A module in a hardened optical platform includes one or more Printed Circuit Boards (PCB) and associated components; at least one cage configured to receive a pluggable optical module, wherein the at least one cage is on a PCB of the one or more PCBs; and a housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow, wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow.

Abstract: A module in a hardened optical platform includes one or more Printed Circuit Boards (PCB) and associated components; at least one cage configured to receive a pluggable optical module, wherein the at least one cage is on a PCB of the one or more PCBs; and a housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow, wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow.

Abstract: A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

Abstract: A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network element chassis is deployed; powering down backplane connectors for replacement while other backplane connectors remained powered; removing the powered down backplane connectors with a connector removal tool; inserting a new set of backplane connectors in place of the removed, powered down backplane connectors with a connector insertion tool; and powering up the new set of backplane connectors.

Abstract: A latch assembly for a cooling unit of a telecommunications shelf assembly, the latch assembly including: a faceplate; a latch handle movably coupled to the faceplate, wherein, when the latch handle is actuated, the cooling unit is attached to/released from the shelf assembly; and a locking mechanism coupled to the latch handle, wherein, when the locking mechanism is actuated, the cooling unit is locked to/unlocked from the shelf assembly; wherein the locking mechanism includes a fan brake actuator mechanism that is coupled to an electronic fan brake switch associated with one or more fans of the cooling unit. Optionally, the latch handle is pivotably coupled to the faceplate and is actuated by rotation. Optionally, the locking mechanism includes a captive screw that is advanced into/backed out of a threaded aperture associated with the faceplate. Optionally, the fan brake actuator mechanism includes a lever member that couples the locking mechanism to the electronic fan brake switch.

Abstract: A cooling fan assembly for use in a telecommunications system, the cooling fan assembly including: a cooling fan including a plurality of radially disposed mounting flanges that are recessed from one or more of an inlet surface and an exhaust surface of the cooling fan; a chassis disposed adjacent to one or more of the inlet surface and the exhaust surface of the cooling fan, wherein a plurality of spaces are formed between the plurality of mounting flanges and the chassis; a plurality of vibration isolators disposed within the plurality of spaces formed between the plurality of mounting flanges and the chassis; and a plurality of rigid pins coupling the chassis to the plurality of vibration isolators. The plurality of vibration isolators are disposed substantially within a volumetric envelope of the cooling fan and the plurality of mounting flanges.

Abstract: A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network element chassis is deployed; powering down backplane connectors for replacement while other backplane connectors remained powered; removing the powered down backplane connectors with a connector removal tool; inserting a new set of backplane connectors in place of the removed, powered down backplane connectors with a connector insertion tool; and powering up the new set of backplane connectors.

Abstract: A latch assembly for a cooling unit of a telecommunications shelf assembly, the latch assembly including: a faceplate; a latch handle movably coupled to the faceplate, wherein, when the latch handle is actuated, the cooling unit is attached to/released from the shelf assembly; and a locking mechanism coupled to the latch handle, wherein, when the locking mechanism is actuated, the cooling unit is locked to/unlocked from the shelf assembly; wherein the locking mechanism includes a fan brake actuator mechanism that is coupled to an electronic fan brake switch associated with one or more fans of the cooling unit. Optionally, the latch handle is pivotably coupled to the faceplate and is actuated by rotation. Optionally, the locking mechanism includes a captive screw that is advanced into/backed out of a threaded aperture associated with the faceplate. Optionally, the fan brake actuator mechanism includes a lever member that couples the locking mechanism to the electronic fan brake switch.

Abstract: A cooling fan assembly for use in a telecommunications system, the cooling fan assembly including: a cooling fan including a plurality of radially disposed mounting flanges that are recessed from one or more of an inlet surface and an exhaust surface of the cooling fan; a chassis disposed adjacent to one or more of the inlet surface and the exhaust surface of the cooling fan, wherein a plurality of spaces are formed between the plurality of mounting flanges and the chassis; a plurality of vibration isolators disposed within the plurality of spaces formed between the plurality of mounting flanges and the chassis; and a plurality of rigid pins coupling the chassis to the plurality of vibration isolators. The plurality of vibration isolators are disposed substantially within a volumetric envelope of the cooling fan and the plurality of mounting flanges.

Abstract: The present invention provides a cooling fan assembly for use in a telecommunications system, including: a cooling fan; a housing; a rigid pin disposed through the housing an into a mounting hole manufactured into the cooling fan; a vibration isolator disposed about the rigid pin within the mounting hole; and a washer disposed about the rigid pin between the cooling fan and the housing. The vibration isolator is a cylindrical vibration isolator. The vibration isolator is made of a polymeric vibration damping material. The washer is made of material with a low coefficient of friction. The vibration isolator is operable for damping vibrations emanating from the cooling fan. The washer is operable for allowing some movement of the cooling fan perpendicular to the rigid pin.

Abstract: A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.

Abstract: A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.

Abstract: A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.

Abstract: A rock fragmentation analysis system is provided for analyzing blasted rock (or other fragmented particles) to assess quality of a blast for efficient processing of subsequent operations in a mine, a quarry, etc. The system includes a hardware system and an image processing system. The hardware system includes a camera and a lighting system. The lighting system illuminates an area of the mine, quarry, etc. where a load haul dump (LHD) vehicle passes through. Once the LHD vehicle passes through the illuminated area, the camera provides video signals of scoop-top view images of the LHD vehicle to the image processing system via known communication means, such as hard-wired and wireless. The image processing system receives the video signals, captures the scoop-top view images, evaluates the images for subsequent fragmentation analysis, and performs the rock fragmentation analysis. The image processing system performs these functions using several software modules.