Abstract: In accordance with a first aspect of the present disclosure, an electronic identification device is provided, comprising an ultra-high frequency (UHF) communication unit, wherein said UHF communication unit is configured to be activated restrictedly. In accordance with a second aspect of the present disclosure, a method of operating an electronic identification device is conceived, said electronic identification device comprising an ultra-high frequency (UHF) communication unit, the method comprising restrictedly activating said UHF communication unit. In accordance with a third aspect of the present disclosure, a non-transitory machine-readable medium is provided, comprising instructions that, when executed, carry out a method of the kind set forth.

Abstract: In accordance with a first aspect of the present disclosure, an electronic identification device is provided, comprising an ultra-high frequency (UHF) communication unit, wherein said UHF communication unit is configured to be activated restrictedly. In accordance with a second aspect of the present disclosure, a method of operating an electronic identification device is conceived, said electronic identification device comprising an ultra-high frequency (UHF) communication unit, the method comprising restrictedly activating said UHF communication unit. In accordance with a third aspect of the present disclosure, a non-transitory machine-readable medium is provided, comprising instructions that, when executed, carry out a method of the kind set forth.

Abstract: In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a fiber-reinforced film of plastics material by means of a layer (73) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film (66, 71), at least one further layer (74, 75, 76) that is able to serve for protecting, damping or fastening purposes.

Abstract: In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47,48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a fiber-reinforced film of plastics material by means of a layer (73) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film (66, 71), at least one further layer (74, 75, 76) that is able to serve for protecting, damping or fastening purposes.

Abstract: A data carrier (1) includes an IC module (3), having a substrate (4), and a conductor configuration (5) connected to the substrate (4), and an IC (2) connected to the substrate (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) The data carrier (1) is equipped with a protection mechanism (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection mechanism (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4).

Abstract: A data carrier (1) includes an IC module (3), which comprises a substrate means (4), and a conductor configuration (5) connected to the substrate means (4), and an IC (2) connected to the substrate means (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) , the data carrier (1) being equipped with a protection means (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection means (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4). FIG. 2.

Abstract: In a module tape (1) comprising modules (2) and comprising a carrier layer (19) to which a plurality of contact-bound-mode module contact zones (9, 10, 11) are attached at the location of a first layer side (20) and to which a plurality of contactless-mode module contact zones (14, 15) are attached at the location of a second layer side (22), the contactless-mode module contact zones (14, 15) are formed by conductor zones deposited on the carrier layer (19) by means of a printing method.

Abstract: A data carrier has a carrier body with a recess, an insulating layer with an outer surface exposed to an environment of the data carrier and with an inner surface, a chip module that is mounted in the recess, and a transmission coil with coil contacts. The chip module has a chip with chip contacts, a cover of electrically insulating material, and a metal lead frame. The transmission coil is mounted in a zone outside the chip module. The metal lead frame has a first part, a second part and a third part. The first, second a third parts are substantially coplanarly arranged with respect to each other. The first part carries the chip at a side remote from the environment, and the second and third parts form lead frame contacts that are electrically coupled to the coil contacts and the chip contacts. The insulating layer and a cover part inside the data carrier form the cover.

Abstract: The transmission coil (11) in a device (1) which includes a data carrier module (3) with a holding (4) and an integrated circuit (6) which is supported by the holding (4) and includes a transmission coil (11) which is electrically conductively connected to the integrated circuit (6) and to the holding (4), is covered, except for the area of its two coil connection contacts (13, 14), by a protective layer (16) of an electrically insulating material, a connection wire being provided between each coil connection contact (13, 14) and an associated circuit connection contact (7, 8), the integrated circuit (6) and the two connection wires (19, 20) and the areas of the two coil connection contacts (13, 14) which are not covered by the protective layer (16) being protectively covered by a single protective cap (10).

Abstract: A key and lock system has a key with an integrated transponder coil that is connected to a transponder unit, and a lock with an integrated write/read coil. The key has a key bit portion and a bow portion. When the key bit portion is inserted into an elongated aperture of a key cylinder of the lock, an axis of the write/read coil forms an acute angle with an axis of the transponder coil. The acute angle substantially differs from a zero degree angle.