Patents by Inventor Peter Schmollngruber

Peter Schmollngruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220328258
    Abstract: A MEMS switch that includes a substrate with a first insulating layer and a silicon layer thereabove, a fixed portion and a movable switching portion being formed in the silicon layer. A first metal layer is situated in recesses in the silicon layer at a side of the silicon layer facing away from the substrate, the first metal layer forming at least one switchable electrical contact between the fixed portion and the switching portion. A method for manufacturing a MEMS switch including at least one embedded metal contact is also described.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 13, 2022
    Inventors: Jochen Reinmuth, Matthew Lewis, Peter Schmollngruber
  • Patent number: 11418885
    Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: August 16, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
  • Publication number: 20220231652
    Abstract: A method for manufacturing a piezoelectric resonator. The method includes: depositing a piezoelectric layer and forming a recess in a lateral area in such a way that a silicon functional layer is exposed inside the recess, forming a silicide layer on a surface of the silicon functional layer exposed inside the recess, forming a diffusion barrier layer on the silicide layer, depositing and structuring a first and second metallization layer in such a way that a supply line and two connection elements are formed, forming the oscillating structure by structuring the silicon functional layer, the silicon functional layer of the oscillating structure being able to be electrically contacted via the first connection element and forming a lower electrode of the resonator, the first metallization layer of the oscillating structure being able to be electrically contacted via the second connection element and forming an upper electrode of the resonator.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Inventors: Friedjof Heuck, Marcus Pritschow, Markus Kuhnke, Peter Schmollngruber, Ricardo Zamora, Sebastien Loiseau, Stefan Majoni, Stefan Krause, Viktor Morosow
  • Publication number: 20220172981
    Abstract: A method for manufacturing a polysilicon SOI substrate including a cavity. The method includes: providing a silicon substrate including a sacrificial layer thereon; producing a first polysilicon layer on the sacrificial layer; depositing a structuring layer on the first polysilicon layer; introducing trenches through the structuring layer, the first polysilicon layer, and the sacrificial layer up to the silicon substrate; producing a cavity in the silicon substrate by etching, an etching medium being conducted thereto through the trenches; producing a second polysilicon layer on the first polysilicon layer, the trenches being thereby closed. A micromechanical device is also described.
    Type: Application
    Filed: November 22, 2021
    Publication date: June 2, 2022
    Inventors: Jochen Reinmuth, Peter Schmollngruber
  • Publication number: 20220090975
    Abstract: A sensor device. The sensor device includes: a substrate; an electrical insulation layer on the substrate; an edge structure disposed on the electrical insulation layer and that delimits an internal region above the substrate; a membrane anchored on the edge structure and at least partly spanning the internal region, the membrane encompassing in the internal region a region movable by a pressure; a first intermediate carrier that extends in the movable region below the membrane and is electrically and mechanically connected to the membrane by contact points, and encompasses at least one spacing element that extends from the intermediate carrier toward the substrate; and a first counter electrode on the electrical insulation layer, the first counter electrode extending under the intermediate carrier, and a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region.
    Type: Application
    Filed: March 26, 2020
    Publication date: March 24, 2022
    Inventors: Heribert Weber, Christoph Hermes, Hans Artmann, Peter Schmollngruber, Thomas Friedrich, Volkmar Senz
  • Publication number: 20220081285
    Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 17, 2022
    Inventors: Heribert Weber, Peter Schmollngruber, Thomas Friedrich, Andreas Scheurle, Joachim Fritz, Sophielouise Mach
  • Publication number: 20220003621
    Abstract: A micromechanical component for a capacitive pressure sensor device, including a diaphragm that is stretched with the aid of a frame structure in such a way that a cantilevered area of the diaphragm spans a framed partial surface, and including a reinforcement structure that is formed at the cantilevered area. A first spatial direction oriented in parallel to the framed partial surface is definable in which the cantilevered area has a minimal extension, and a second spatial direction oriented in parallel to the framed partial surface and oriented perpendicularly with respect to the first spatial direction is definable in which the cantilevered area has a greater extension. The reinforcement structure is present at a first distance from the frame structure in the first spatial direction, and at a second distance in the second spatial direction, the second distance being greater than the first distance.
    Type: Application
    Filed: December 18, 2019
    Publication date: January 6, 2022
    Inventors: Thomas Friedrich, Christoph Hermes, Hans Artmann, Heribert Weber, Peter Schmollngruber, Volkmar Senz
  • Publication number: 20220002147
    Abstract: A method for sealing entries in a MEMS element. The method includes: providing a functional layer having a functional region; producing a cavity underneath the functional region of the functional layer with the aid of a first entry outside of the functional region of the functional layer; sealing the first entry; producing a second entry to the cavity outside of the functional region of the functional layer; melting sealing material in the region of the second entry; and cooling off the melted sealing material to seal the second entry.
    Type: Application
    Filed: December 13, 2019
    Publication date: January 6, 2022
    Applicant: Robert Bosch GmbH
    Inventors: Christoph Hermes, Hans Artmann, Heribert Weber, Peter Schmollngruber, Thomas Friedrich, Tobias Joachim Menold, Mawuli Ametowobla
  • Publication number: 20210395074
    Abstract: A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.
    Type: Application
    Filed: December 13, 2019
    Publication date: December 23, 2021
    Inventors: Hans Artmann, Christoph Hermes, Heribert Weber, Jochen Reinmuth, Peter Schmollngruber, Thomas Friedrich
  • Publication number: 20210354978
    Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.
    Type: Application
    Filed: May 10, 2021
    Publication date: November 18, 2021
    Inventors: Heribert Weber, Andreas Scheurle, Joachim Fritz, Peter Schmollngruber, Sophielouise Mach, Thomas Friedrich
  • Publication number: 20210292160
    Abstract: A method for producing a wafer connection between a first and a second wafer. The method includes providing a first and second material for forming a eutectic alloy, providing a first wafer having a receiving structure for a die structure, filling the receiving structure with the first material, providing a second wafer having a die structure, the second material being situated on the die structure, providing a stop structure on the first and/or second wafer, so that when the two wafers are joined, a defined stop is provided, heating the first and second material at least to the eutectic temperature of the eutectic alloy, joining the first and second wafer so that the die structure is at least partly introduced into the receiving structure, the stop structure, the receiving structure, the die structure.
    Type: Application
    Filed: September 24, 2019
    Publication date: September 23, 2021
    Inventors: Friedjof Heuck, Jochen Tomaschko, Peter Schmollngruber, Thomas Friedrich, Volkmar Senz, Franziska Rohlfing
  • Publication number: 20210215559
    Abstract: A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.
    Type: Application
    Filed: June 28, 2019
    Publication date: July 15, 2021
    Inventors: Heribert Weber, Peter Schmollngruber
  • Publication number: 20210219058
    Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 15, 2021
    Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
  • Publication number: 20200399116
    Abstract: A MEMS element is provided. The MEMS element includes: a substrate; a first passivation layer arranged on the substrate; a metal layer arranged on the first passivation layer; a second passivation layer arranged on the metal layer and on the first passivation layer; and a punch element, an electrically conductive diffusion-blocking layer being arranged on the punch element and on the second passivation layer, a first bonding element being arranged on the punch element.
    Type: Application
    Filed: March 7, 2019
    Publication date: December 24, 2020
    Inventors: Friedjof Heuck, Jochen Tomaschko, Peter Schmollngruber, Thomas Friedrich, Volkmar Senz, Mike Schwarz
  • Publication number: 20200200631
    Abstract: A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 25, 2020
    Inventors: Thomas Friedrich, Christoph Hermes, Hans Artmann, Heribert Weber, Peter Schmollngruber, Volkmar Senz
  • Patent number: 8299549
    Abstract: A layer structure for the electrical contacting of a semiconductor component having integrated circuit elements and integrated connecting lines for the circuit elements, which is suitable in particular for use in a chemically aggressive environment and at high temperatures, i.e., in so-called “harsh environments,” and is simple to implement. This layer structure includes at least one noble metal layer, in which at least one bonding island is formed, the noble metal layer being electrically insulated from the substrate of the semiconductor component by at least one dielectric layer, and having at least one ohmic contact between the noble metal layer and an integrated connecting line. The noble metal layer is applied directly on the ohmic contact layer.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: October 30, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Reinmuth, Peter Schmollngruber, Hans Artmann
  • Patent number: 8196474
    Abstract: A simple to implement contacting variant makes it possible to create a reliable electrical connection between the sensor element and the evaluation electronics of a pressure sensor, including at least one media-resistant sensor element, evaluation electronics in the form of at least one additional component connected electrically to the sensor element, and a multipart housing, the sensor element being situated in a first housing area having at least one pressure connection, and the evaluation electronics being situated in a second sealed housing area which is separated from the first housing area by a separating wall. The electrical connection between the sensor element and the evaluation electronics is implemented in the form of media-resistant bonding wires which are guided from the first into the second housing area through the bonded joint area between the separating wall and an additional housing part.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: June 12, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Reinmuth, Peter Schmollngruber, Hans Artmann
  • Patent number: 8076739
    Abstract: A micromechanical component includes a substrate that has a front side and a backside, the front side having a functional pattern, which functional pattern is electrically contacted to the backside in a contact region. The substrate has at least one contact hole in the contact region, which extends into the substrate, starting from the backside.
    Type: Grant
    Filed: May 26, 2008
    Date of Patent: December 13, 2011
    Assignee: Robert Bosch GmbH
    Inventors: Peter Schmollngruber, Hans Artmann, Thomas Wagner
  • Publication number: 20110127674
    Abstract: A layer structure for the electrical contacting of a semiconductor component having integrated circuit elements and integrated connecting lines for the circuit elements, which is suitable in particular for use in a chemically aggressive environment and at high temperatures, i.e., in so-called “harsh environments,” and is simple to implement. This layer structure includes at least one noble metal layer, in which at least one bonding island is formed, the noble metal layer being electrically insulated from the substrate of the semiconductor component by at least one dielectric layer, and having at least one ohmic contact between the noble metal layer and an integrated connecting line. The noble metal layer is applied directly on the ohmic contact layer.
    Type: Application
    Filed: November 23, 2010
    Publication date: June 2, 2011
    Inventors: Jochen Reinmuth, Peter Schmollngruber, Hans Artmann
  • Publication number: 20110048137
    Abstract: A simple to implement contacting variant makes it possible to create a reliable electrical connection between the sensor element and the evaluation electronics of a pressure sensor, including at least one media-resistant sensor element, evaluation electronics in the form of at least one additional component connected electrically to the sensor element, and a multipart housing, the sensor element being situated in a first housing area having at least one pressure connection, and the evaluation electronics being situated in a second sealed housing area which is separated from the first housing area by a separating wall. The electrical connection between the sensor element and the evaluation electronics is implemented in the form of media-resistant bonding wires which are guided from the first into the second housing area through the bonded joint area between the separating wall and an additional housing part.
    Type: Application
    Filed: July 29, 2010
    Publication date: March 3, 2011
    Inventors: Jochen REINMUTH, Peter Schmollngruber, Hans Artmann