Abstract: An improved antenna array (100) comprises a set of array elements (102 a-p) electromagnetically coupled to a transmission line. The transmission line comprises a live conductor (122) and a return conductor, and the live conductor (122) is terminated by a direct connection to the return conductor. An input signal fed to the live conductor (122) is radiated by the array elements (102 a-p) and the antenna array (100) is arranged such that any portion of the input signal reaching the termination is reflected at the termination so as to form a reflected signal that superimposes with the input signal to produce a predetermined farfield radiation pattern.

Abstract: A light emitting device includes a mounting substrate having a reflective layer that defines spaced apart anode and cathode pads, and a gap between them. A light emitting diode die is flip-chip mounted on the mounting substrate, such that the anode contact of the LED die is bonded to the anode pad and the cathode contact of the LED die is bonded to the cathode pad. A lens extends from the mounting substrate to surround the LED die. The reflective layer extends on the mounting substrate to cover substantially all of the mounting substrate that lies beneath the lens, excluding the gap, and may also extend beyond the lens.

Abstract: A digital signage system comprising: a client device associated with a display device and linked to a server through the worldwide network, and having a user input device, the client device being configured to perform the following functions: (a) receiving a signal from the server, the signal corresponding to signage; (b) displaying the signage based on the signal; (c) displaying a window to configure the signage, the window being displayed in front of the signage, the window providing inputs to select content and/or format of the signage; (d) transmitting a selection of the content and/or format to the server when the selection is entered by a user; (e) receiving an updated signal from the server corresponding to the signage modified according to the selection; and (f) displaying the modified signage while the window is displayed, thereby providing the user with near real-time feedback of changes made to the signage.

Abstract: In a system and method for transporting wind turbine tower sections on a shipping vessel a pair of support members is secured to a first wind turbine tower section generally at opposite ends of the first tower section. Another pair of support members is secured to a second wind turbine tower section generally at opposite ends of the second tower section. A pair of elongate mounting members is secured on a support surface of the shipping vessel in spaced relationship with each other. One of the support members of the first tower section and one of the support members of the second tower section are secured to one of the elongate mounting members. The other one of the support members of the first tower section and the other one of the support members of the second tower section are secured to the other one of the elongate mounting members.

Abstract: A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate, one or more light emitting diodes (LEDs) disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. In one aspect, a method for making a light emitting device is disclosed. The method can include providing a substrate with one or more LEDs comprising electrical connectors. The method can further include providing a retention material on at least a portion of the substrate wherein the retention material is disposed over at least a portion of the electrical connectors.

Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.

Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Abstract: Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.

Abstract: A maneuverable fishing lure for attachment to a fishing line includes a lure body including a first end and a second end. An attachment means joins to the fishing line where a retrieval of the fishing line imparts motion on the lure through water. A rudder is pivotally joined to the lure body proximate to the first end. The rudder is pivotal between a first position and a second position about a pivot axis substantially perpendicular to an axis extending through the first end and the second end. With the rudder in the first position, the motion causes the lure to travel through the water in a first direction. With the rudder in the second position, the motion causes the lure to and travel through the water in a second direction. A change in the motion causes the rudder to pivot between the first position and the second position.

Abstract: An apparatus for manufacturing a three-dimensional object by layerwise consolidation of powder comprises a lowerable build platform for supporting the object during manufacture and a sealable chamber for controlling the atmosphere around the object. The apparatus also has gas transport devices, such as pumps and valves. Substantially all of the gas transport devices are maintained within a controlled atmosphere.

Abstract: A filter assembly for an additive manufacturing apparatus has a housing defining a gas inlet and a gas outlet. A filter element is located within the housing between the gas inlet and the gas outlet. The assembly includes valves that can be actuated to seal the gas inlet and the gas outlet. Additionally the assembly has a fluid inlet for allowing ingress of a fluid into the housing. The assembly allows a filter element, which may contain volatile particles, to be changed safely. By sealing the gas inlet and outlet and flooding the housing with a suitable fluid, volatile particles captured by the filter can be neutralised.

Abstract: An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

Abstract: The present invention relates to a system for dissipating heat for one or more electrical components. A first solid heat dissipation structure is connected to a heatsink connection pad of the component while a second heat dissipation structure surrounds the first structure but not in contact with the connection pad to thermally regulate the heat of the electrical component.

Abstract: An apparatus (10) for forming a three dimensional object (30) by layer-wise addition of a build material has a build-support (100) for supporting the object (30) during forming and a removable metallic base-layer (110) that is in the form of a mesh, film, sheet or foil. The base-layer (110) is removably securable to the build support (100).

Abstract: An additive manufacturing powder dispenser has a metering member for dispensing a line of powder to be used in an additive manufacturing process. The metering member has one or more metering voids that extend through the metering member with entrance openings defined in a first face of the metering member and exit openings defined in a second face of the metering member. In use, powder passes into the metering member through the entrance openings, is maintained within the metering member, and passes out of the metering member through the exit openings to dispense a line of powder.