Abstract: A surface acoustic wave resonator arrangement comprises a piezoelectric substrate (100) and a surface acoustic wave resonator (110) which includes an interdigital transducer (111,112) disposed on the piezoelectric substrate (100). A trench (13 0) is disposed within the piezoelectric substrate (100) facing the resonator (110). Trench (130) causes reflected waves (143,144) in response to waves (141,142) leaking from the surface acoustic wave resonator. Trench (130) is configured such that the reflected acoustic waves (143,144) achieve phases at the edge (115) of the resonator (110) such that the accumulated phases of all the reflected waves received at edge (115) is zero or substantially zero, thereby avoiding constructive interference of the reflected waves with the acoustic waves resonating in the resonator. Thereby undesired acoustic coupling between resonators or influence of waves reflected at edges of the piezoelectric substrate or dicing lines is reduced.

Abstract: An antenna duplexer includes a transmission filter which operates in a transmission frequency band and has a transmission filter output. A reception filter operates in a reception frequency band and has a reception filter output. An antenna connection is connected to the transmission filter output and a matching element is connected between the antenna connection and the reception filter input. The circuit formed from the transmission filter, reception filter and matching element attenuates transmission signals in a frequency band whose frequencies f are in the interval 0.50*f0<=f<=0.75*f0, where f0 is the mid-frequency of the reception frequency band.

Abstract: An antenna duplexer includes a transmission filter which operates in a transmission frequency band and has a transmission filter output. A reception filter operates in a reception frequency band and has a reception filter output. An antenna connection is connected to the transmission filter output and a matching element is connected between the antenna connection and the reception filter input. The circuit formed from the transmission filter, reception filter and matching element attenuates transmission signals in a frequency band whose frequencies f are in the interval 0.50*f0<=f<=0.75*f0, where f0 is the mid-frequency of the reception frequency band.

Abstract: An electrical component includes a substrate, component structures on the substrate, and solder metal platings electrically connected to the component structures. The substrate is electrically and mechanically connected in a flip chip arrangement to a carrier via connections formed by solder bumps. The solder bumps mate to the solder metal platings. At least one of the solder bumps is on a first solder metal plating. The first solder metal plating has first and second dimensions, where the first dimension is larger than the second dimension.

Abstract: A component includes a carrier substrate having a coefficient of thermal expansion ?p and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion ?1 in a first direction x1 and a first expansion difference, ??1 equal to the absolute value of ?p??1. The chip also has a second coefficient of thermal expansion ?2 in a second direction x2 and a second expansion difference ??2 is equal to the absolute value of ?p??2,. The bumps are arranged such that a first distance, ?x1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.

Abstract: A component includes a carrier substrate having a coefficient of thermal expansion ?p and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion ?1 in a first direction x1 and a first expansion difference, ??1 equal to the absolute value of ?p??1. The chip also has a second coefficient of thermal expansion ?2 in a second direction x2 and a second expansion difference ??2 is equal to the absolute value of ?p??2,. The bumps are arranged such that a first distance, ?x1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.

Abstract: An electrical component having reduced substrate area is suggested, in which a substrate (S) having component structures (BS), on one surface of which solder metal platings (LA), which are electrically connected to the component structures, are positioned, is electrically and mechanically connected in a flip chip arrangement to a carrier (T) via bump connections formed by solder bumps (B). The solder bumps are seated on the solder metal platings of the substrate. At least one of the bump connections is seated on a non-round solder metal plating, which has a relatively small dimension along a first axis and a larger dimension along a second axis positioned transversely thereto.

Abstract: A DMS filter is proposed with first and second interdigital transducers as a signal input or output that are located between reflector structures, wherein at least one acoustic track has a middle transducer that is split into partial transducers symmetric with respect to the perpendicular to the direction of propagation. The DMS filter is connected in a symmetrical manner to a housing using connection pads or connection pins in order to produce an axis-symmetrical connection layout.

Abstract: In a SAW filter of the reactance type having at least two SAW resonators in two parallel branches and a SAW resonator in a serial branch, the invention provides that an electrical connection fashioned on the substrate of the ground sides of the two SAW resonators in the parallel branches is done before the bonding to the housing in order to achieve a shift of the pole point belonging to the parallel branch to a lower frequency.

Abstract: A DMS filter is proposed with first and second interdigital transducers as a signal input or output that are located between reflector structures, wherein at least one acoustic track has a middle transducer that is split into partial transducers symmetric with respect to the perpendicular to the direction of propagation. The DMS filter is connected in a symmetrical manner to a housing using connection pads or connection pins in order to produce an axis-symmetrical connection layout.

Abstract: A surface acoustic wave (SAW) filter having an improved edge steepness includes at least three resonators connected in series and/or parallel with one another. An edge steepness of a pass band is improved if a plurality of resonators with different finger periodicities of interdigital transducers are provided.