Patents by Inventor Peter Shaw Modauer

Peter Shaw Modauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for evaluating signal coupling between differential traces in a package design
    Patent number: 7117464
    Abstract: A method is provided for evaluating trace signal coupling in an electronic design (e.g., a package design). In the method, one or more trace signal coupling rules are formulated. One or more trace pairs designed to carry differential signals are then processed to determine whether the inter-trace spacing between the trace pairs violates the trace signal coupling rules. An indicator (e.g., a DRC and/or a report) is generated to identify violated trace signal coupling rules. Processing of the electronic design may be scoped according one or a group of signal nets, or one or a group of levels of the package design.
    Type: Grant
    Filed: February 18, 2003
    Date of Patent: October 3, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark D. Frank, Jerimy Nelson, Peter Shaw Modauer
  • System and method for evaluating signal coupling between differential traces in a package design
    Publication number: 20040163058
    Abstract: A method is provided for evaluating trace signal coupling in an electronic design (e.g., a package design). In the method, one or more trace signal coupling rules are formulated. One or more trace pairs designed to carry differential signals are then processed to determine whether the inter-trace spacing between the trace pairs violates the trace signal coupling rules. An indicator (e.g., a DRC and/or a report) is generated to identify violated trace signal coupling rules. Processing of the electronic design may be scoped according one or a group of signal nets, or one or a group of levels of the package design.
    Type: Application
    Filed: February 18, 2003
    Publication date: August 19, 2004
    Inventors: Mark D. Frank, Jerimy Nelson, Peter Shaw Modauer
  • System and method for evaluating signal coupling between vias in a package design
    Publication number: 20040163056
    Abstract: A method is provided for evaluating via signal coupling in an electronic design (e.g., a package design). In the method, one or more via signal coupling rules are formulated. One or more via pairs designed to carry differential signals are then processed to determine whether the inter-via spacing between the via pairs violates the via signal coupling rules. An indicator (e.g., a DRC and/or a report) is generated to identify violated via signal coupling rules. Processing of the electronic design may be scoped according one or a group of signal nets, or one or a group of levels of the package design.
    Type: Application
    Filed: February 19, 2003
    Publication date: August 19, 2004
    Inventors: Mark D. Frank, Jerimy Nelson, Peter Shaw Modauer