Abstract: A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.

Abstract: A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.