Patents by Inventor Peter Sorce

Peter Sorce has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser ablation for integrated circuit fabrication
    Patent number: 8419895
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 16, 2013
    Assignee: International Business Machines Corporation
    Inventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Laser Ablation for Integrated Circuit Fabrication
    Publication number: 20110290406
    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
  • Handler Attachment for Integrated Circuit Fabrication
    Publication number: 20110290402
    Abstract: A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul Andry, Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang