Patents by Inventor Peter Stanley

Peter Stanley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing SOI wafers by delamination
    Patent number: 6420243
    Abstract: This invention provides a method for producing SOI wafers by delamination comprising the steps of preparing a first wafer (2) having an insulating layer (3) on its both major surfaces; providing two delamination planes (4; 4′) in the interior of said first wafer (2); bonding a second wafer (1) on one side of the first wafer (2); bonding a third wafer (1′) on the other side of the first wafer (2); and delaminating said second and third wafers (1; 1′) from said first wafer (2) such that each of said second and third wafers (1; 1′) carries a SOI layer (3, 7; 3′, 7′) on one of its major surfaces.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: July 16, 2002
    Assignee: Motorola, Inc.
    Inventors: Timothy Daryl Stanley, Peter Stanley
  • METHOD FOR PRODUCING SOI WAFERS BY DELAMINATION
    Publication number: 20020068418
    Abstract: This invention provides a method for producing SOI wafers by delamination comprising the steps of preparing a first wafer (2) having an insulating layer (3) on its both major surfaces; providing two delamination planes (4; 4′) in the interior of said first wafer (2); bonding a second wafer (1) on one side of the first wafer (2); bonding a third wafer (1′) on the other side of the first wafer (2); and delaminating said second and third wafers (1; 1′) from said first wafer (2) such that each of said second and third wafers (1; 1′) carries a SOI layer (3, 7; 3′, 7′) on one of its major surfaces.
    Type: Application
    Filed: December 4, 2000
    Publication date: June 6, 2002
    Applicant: Motorola, Inc.
    Inventors: Timothy Daryl Stanley, Peter Stanley