Abstract: A forging press for rotationally asymmetrical parts by warm or hot forming has a stationary press table, a vertically shiftable press ram above the press table, vertically delimiting with the press table a working space, and vertically displaceable between from an upper open position into a lower closed position. An upper part is carried by the ram in the space, and an upper die in the space is in turn carried on the upper part. A lower part sits on the table in the space and below the upper part and carries a lower die in the space and fittable with the upper die in the closed position. A first closing apparatus outside the space bears vertically on one of the dies, and a second closing apparatus outside the space bears vertically via the first closing apparatus on the one die.

Abstract: A forging press for rotationally asymmetrical parts by warm or hot forming has a stationary press table, a vertically shiftable press ram above the press table, vertically delimiting with the press table a working space, and vertically displaceable between from an upper open position into a lower closed position. An upper part is carried by the ram in the space, and an upper die in the space is in turn carried on the upper part. A lower part sits on the table in the space and below the upper part and carries a lower die in the space and fittable with the upper die in the closed position. A first closing apparatus outside the space bears vertically on one of the dies, and a second closing apparatus outside the space bears vertically via the first closing apparatus on the one die.

Abstract: A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

Abstract: A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

Abstract: A method of evaluating performance data assigns a weight to each of a plurality of key performance indicators (“KPIs”). Each KPI having an associated bin and corresponding to a portion of a bin score. A weight is assigned to each bin, and each bin corresponds to a scorecard and corresponds to a predefined portion of an overall score. Received performance data is compared to each KPI in at least one selected bin to determine a score for each KPI in the at least one selected bin. An overall score is dynamically calculated on a server in response to the at least one selected bin, in response to the assigned weight of the at least one selected bin and the assigned weights of its corresponding KPIs, and in response to the scores for the selection of KPIs. A scorecard including at least the overall score is transmitted to a user.

Abstract: An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a waveguide around the opening, wherein the transmission line is connected to the at least one conductor such that a signal traveling along the transmission line is guided toward the opening in the first side by the at least one conductor.

Abstract: In one aspect, an embodiment of the invention provides a transition from a planar substrate/chip circuit microwave transmission line to waveguide transmission media on the back of the substrate/chip. The transition enables planar waveguide fed MMW ESA architectures to be realized within the tight grid spacing required for emerging MMW ESAs.

Abstract: A method and system for assessing the risk that an entity (50) will not meet performance expectations wherein dependencies (52, 54) of the entity are identified and external factors (56, 60, 62, 64) that reflect changes in such dependencies are determined. Indicators (58, 68, 70, 72) that affect the external factors are also established and condition levels (59, 69, 71 and 73) are assigned to the external factors based on rules to which such indicators are applied. The performance risk of the entity is evaluated from the condition levels of the external factors.

Abstract: In one aspect, an embodiment of the invention provides a transition from a planar substrate/chip circuit microwave transmission line to waveguide transmission media on the back of the substrate/chip. The transition enables planar waveguide fed MMW ESA architectures to be realized within the tight grid spacing required for emerging MMW ESAs.

Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.

Abstract: An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a waveguide around the opening, wherein the transmission line is connected to the at least one conductor such that a signal traveling along the transmission line is guided toward the opening in the first side by the at least one conductor.

Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.

Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.

Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.

Abstract: A subharmonic image rejection and image enhancement mixer for mixing millimeter wavelength signals using a low conversion loss technique is described. A local oscillator frequency from an external source is fed to a first subharmonic mixer and through a phase shifter to a second subharmonic mixer. The phase shifter delays the local oscillator signal by (90.degree./n), where n is the multiple of the subharmonic mixers and is greater than 1. The first and second subharmonic mixers mix the local oscillator frequency with an input signal, which includes a desired frequency and an image frequency, to produce an intermediate frequency having a desired component and an image component at a select phase. A 0.degree.-90.degree. hybrid separates and terminates the image component of the intermediate frequency.