Patents by Inventor Peter Stormberg

Peter Stormberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solderless integrated package connector and heat sink for LED
    Patent number: 7638814
    Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: December 29, 2009
    Assignee: Philips Lumileds Lighting Company, LLC
    Inventors: Franklin Wall, Jr., Peter Stormberg, Jeffrey Kmetec, Mina Farr, Li Zhang
  • Solderless Integrated Package Connector and Heat Sink for LED
    Publication number: 20080315214
    Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Applicant: PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Franklin Wall, JR., Peter Stormberg, Jeffrey Kmetec, Mina Farr, Li Zhang