Abstract: A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

Abstract: A downhole pumping apparatus comprising a positive displacement rotary gear pump (RGP), driven by a rotating rod string or a submersible electric motor.

Abstract: A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

Abstract: A downhole pumping apparatus comprising a positive displacement rotary gear pump (RGP), driven by a rotating rod string or a submersible electric motor.

Abstract: An activatable thermal fuse includes a first electrical terminal, a second electrical terminal, and an electrically conductive bridge element having a first electric contact with the first electrical terminal and a second electric contact with the second electrical terminal. At least a part of the bridge element is displaceable from a first position in which the first contact is established to a second position in which the first contact is opened, and a thermally sensitive member releases the part when exposed to a predetermined temperature value. An activating element blocks displacement of the part from the first position, in a first position of the activating element, and enables the displacement of the part in a second position of the activating element. A method of manufacturing a printed circuit board, a method of monitoring, and an electronic circuit including the thermal fuse are also provided.

Abstract: A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

Abstract: A downhole pumping apparatus comprising a positive displacement rotary gear pump (RGP), driven by a rotating rod string or a submersible electric motor.

Abstract: The invention relates to a fuse element (12_1; 12_2), comprising two connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) and an interposed conductive track (26_1; 26_2), wherein the conductive track (26_1; 26_2) has a reduced line-cross-section, in relation, to the connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) at least in some sections, further comprising at least one overlay (16_1; 16_2?, 16_2?), wherein the fuse element (12_1; 12_2) and the overlay (16_1; 16_2?, 16_2?) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (12_1; 12_2). The invention further relates to a fuse (TO) having such a fuse element (12_1; 12_2) and a base support (14), wherein the fuse element (12_1; 12_2) is disposed on a surface of the base support (14).

Abstract: An activatable thermal fuse includes a first electrical terminal, a second electrical terminal, and an electrically conductive bridge element having a first electric contact with the first electrical terminal and a second electric contact with the second electrical terminal. At least a part of the bridge element is displaceable from a first position in which the first contact is established to a second position in which the first contact is opened, and a thermally sensitive member releases the part when exposed to a predetermined temperature value. An activating element blocks displacement of the part from the first position, in a first position of the activating element, and enables the displacement of the part in a second position of the activating element. A method of manufacturing a printed circuit board, a method of monitoring, and an electronic circuit including the thermal fuse are also provided.

Abstract: The invention relates to a fuse element (12_1; 12_2), comprising two connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) and an interposed conductive track (26_1; 26_2), wherein the conductive track (26_1; 26_2) has a reduced line-cross-section in relation to the connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) at least in some sections, further comprising at least one overlay (16_1; 16_2?, 16_2?), wherein the fuse element (12_1; 12_2) and the overlay (16_1; 16_2?, 16_2?) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (12_1; 12_2). The invention further relates to a fuse (IO) having such a fuse element (12_1; 12_2) and a base support (14), wherein the fuse element (12_1; 12_2) is disposed on a surface of the base support (14).

Abstract: A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

Abstract: A fuse element (10), in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material (11), which is usable particularly in the multilayer technology and is coated with a metal or metal alloy (15), from which metal or metal alloy the fuse (12) is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse (10) is distinguished in that the printed circuit board substrate material (11), on which the fuse (12) can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy (15) from which the fuse (12) is made.

Abstract: A spring device which operates in tension to be used in attenuating shock loads in a flexible tension element, which can be used, for example, on the mooring rope of a floating vessel. Also a spring device acting in compression which can serve as shock attenuating standoff for use, say, in holding a floating vessel away from contact with a mooring structure. Also, a device to provide slack or give in a mooring rope to allow a moored floating vessel to freely rise and fall with varying water levels such as caused by tides. Secondly, a device, which by virtue of its shape, creates a retarding force when slid along a flexible tension element, such as a rope. This force is easily modulated by varying the tension in the element. A possible use would be to control, from below, the rate of descent of an object being lowered down a rope.

Abstract: A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.

Abstract: A device for producing a rotating flow in a rectangular flow duct which has a flue-gas outlet of an incineration plant, in particular of a garbage incineration plant, and a transition region from a combustion chamber of the incineration plant to the flue-gas outlet. First wall sections on two opposite walls define the flow duct and have a wall width b. The first wall sections have a length l1 of at least approximately 0.4b<0.8b. These first wall sections, with the center longitudinal axis of the flow duct as axis of symmetry, are centrosymmetrically opposite one another and are defined on the one side by the adjacent wall. In the first wall sections, first nozzles for media which can be emitted in the form of a jet are oriented in a row in an injection plane in such a way that they inject a jet into the injection plane, the angle lying in the injection plane between the wall and an injected jet being at least approximately 90°.

Abstract: A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.

Abstract: In a printed circuit board (10), in which at least one signal conductor (13) runs through a dielectric comprising at least one dielectric layer (12, 15), an improved signal integrity in conjunction with simplified producability which is more flexible with regard to the layout is achieved by virtue of the fact that, for electrical radio-frequency screening, the at least one signal conductor (13) is surrounded by a plurality of electrically conductive holes (18), which are spaced apart from one another.

Abstract: A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8) The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).

Abstract: A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).

Abstract: A process is described for producing fiber-reinforced light-metal castings in which a loose fiber tangle is placed in a casting mold and is saturated with molten light-metal under low pressure. Subsequently, the excess of molten light-metal is squeezed off while the fiber tangle is compressed. The outflow of the molten light-metal is then stopped with the molten light-metal being solidified under high pressure. The process is especially suitable for utilizing the solution-spun inorganic fiber tangles that up to now had not been especially suitable for the reinforcing of light-metals.