Abstract: A method and apparatus for producing a radio frequency absorbing (RFA) or perfect microwave absorbing (PMA) printed circuit board (PCB) is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA PCB, which may comprise a multi-layered assembly for absorption of electromagnetic radiation in a targeted frequency range such as the microwave frequency range in the PCB.

Abstract: A method for producing a magnetic resonant frequency (MRF) absorber and apparatus for an MRF absorber are described herein. The method comprises processing a high permeability material such as permalloy comprising 80% nickel, 18% iron, 2% molybdenum to create a specific geometric form factor such as a flake, sphere, or rod. The geometric form factor may then be encapsulated in an insulating matrix. The insulating matrix may be a Potassium Silicate (SiO3K2). The insulated flake, sphere, or rod form factor may be introduced to a powder coating process. The insulated flake, sphere, or rod form factor may then be mixed with a polymeric coating powder at a weight ratio based on a desired performance for absorbing electromagnetic interference (EMI).

Abstract: A method and apparatus for producing a radio frequency absorber (RFA) or perfect microwave absorber (PMA) skin is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA skin, which may then be applied to a multi-layered assembly for absorption of electromagnetic radiation in a frequency range such as the microwave frequency spectrum in a final product including but limited to cell phones, communication devices, or other electronic devices.

Abstract: A method and apparatus for producing a radio frequency absorber (RFA) or perfect microwave absorber (PMA) skin is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA skin, which may then be applied to a multi-layered assembly for absorption of electromagnetic radiation in a frequency range such as the microwave frequency spectrum in a final product including but limited to cell phones, communication devices, or other electronic devices.

Abstract: A method and apparatus for producing a radio frequency absorbing (RFA) or perfect microwave absorbing (PMA) printed circuit board (PCB) is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA PCB, which may comprise a multi-layered assembly for absorption of electromagnetic radiation in a targeted frequency range such as the microwave frequency range in the PCB.

Abstract: A method for producing a magnetic resonant frequency (MRF) absorber and apparatus for an MRF absorber are described herein. The method comprises processing a high permeability material such as permalloy comprising 80% nickel, 18% iron, 2% molybdenum to create a specific geometric form factor such as a flake, sphere, or rod. The geometric form factor may then be encapsulated in an insulating matrix. The insulating matrix may be a Potassium Silicate (SiO3K2). The insulated flake, sphere, or rod form factor may be introduced to a powder coating process. The insulated flake, sphere, or rod form factor may then be mixed with a polymetric coating powder at a weight ratio based on a desired performance for absorbing electromagnetic interference (EMI).